METHOD FOR DIRECT METAL BONDING

Method including the steps of a) Providing a first stack including a first substrate on which is deposited a first metal layer including a first metal, and a first solubilization layer distinct from the first metal layer, the first solubilization layer including a first getter material configured to...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DI CIOCCIO, Léa, BAUDIN, Floriane
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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