SEMICONDUCTOR DEVICE

A semiconductor device includes first and second semiconductor chips, a plurality of leads, a plurality of wires, and a sealing body sealing those components. A first pad electrode, a second pad electrode, and an internal wiring electrically connected to the first and second electrode pads are forme...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: UEMURA, Akira, SOMA, Osamu, NISHIKIZAWA, Atsushi, NAKAMURA, Hiroyuki, DANNO, Tadatoshi
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
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