HOT MELT ADHESIVE BASED ON LOW MELTING POINT POLYPROPYLENE HOMOPOLYMERS

A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has about 10% to about 70% by weight of a polypropylene homopolymer having a DSC melting point of less than 100° C.; about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point of about 95...

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Hauptverfasser:	HAMANN, RICHARD, RACHOW, LIANNE
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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creator	HAMANN, RICHARD RACHOW, LIANNE
description	A hot melt adhesive for use on porous substrates, wherein the hot melt adhesive has about 10% to about 70% by weight of a polypropylene homopolymer having a DSC melting point of less than 100° C.; about 10% to about 60% of a first tackifying resin having a Ring & Ball Softening Point of about 95° C. to about 140° C.; about 0% to about 65% of a second tackifying resin that is different than the first tackifying resin; about 5% to about 50% of a plasticizer; about 1% to about 40% by weight of a secondary polymer which is either a semi crystalline polymer or wax with an enthalpy of fusion of greater than 30 Joules/gram; about 0.1% to about 5% of a stabilizer or antioxidant; wherein the components total 100% by weight of the composition, and the viscosity of the composition is equal to or less than about 20,000 centipoise (cP) at 163° C. (325° F.).
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subjects	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
title	HOT MELT ADHESIVE BASED ON LOW MELTING POINT POLYPROPYLENE HOMOPOLYMERS
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