METHODS FOR MANUFACTURING A SEMICONDUCTOR DEVICE

According to one embodiment, a manufacturing method of a semiconductor device (100) includes: the transferring of a first group (11) of semiconductor chips (10) from a first support (31) to a second support (32); the deforming of the second support (32) to convert a first pitch between the chips (10...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Endo, Mitsuyoshi
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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