LEAD FRAME CONSTRUCT FOR LEAD-FREE SOLDER CONNECTIONS

An electronics packaging arrangement, a lead frame construct for use in an electronics packaging arrangement, and a method for manufacturing an electronics packaging arrangement. A lead frame made of copper, for example, includes a metallic barrier layer of nickel, for example, to prevent oxidation...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ALBAUGH, KEVIN, B, LI, JIANXING
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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