A LAB-ON-A-CHIP FABRICATION METHOD
A lab-on-a-chip system, and a method for fabrication of a lab-on-a-chip system. The system comprises a chip having a fluid port and being overmoulded by a moulding material in at least an area surrounding the fluid port, and having moulding material extending away from the chip, said moulding materi...
Gespeichert in:
| Hauptverfasser: | , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | MIELNIK, Michal Marek ANDREASSEN, Erik TOFTEBERG, Terje Rosquist |
| description | A lab-on-a-chip system, and a method for fabrication of a lab-on-a-chip system. The system comprises a chip having a fluid port and being overmoulded by a moulding material in at least an area surrounding the fluid port, and having moulding material extending away from the chip, said moulding material extending away from the chip having in a first surface overlying at least part of the chip a fluid channel in communication with the fluid port of the chip, and the chip has one or more of:
- a ledge or ledges along the sides thereof, and the ledge or ledges being overmoulded by said moulding material for securing the chip, and
- an area of the chip surrounding the fluid port comprises one or more of trenches, roughened surface, and treated surface, for enhancing adherence of moulding material on that area to the chip. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP2992550B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP2992550B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP2992550B13</originalsourceid><addsrcrecordid>eNrjZFByVPBxdNL199N11HX28AxQcHN0CvJ0dgzx9PdT8HUN8fB34WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BRpaWRqamBk6GxkQoAQC60yGP</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>A LAB-ON-A-CHIP FABRICATION METHOD</title><source>esp@cenet</source><creator>MIELNIK, Michal Marek ; ANDREASSEN, Erik ; TOFTEBERG, Terje Rosquist</creator><creatorcontrib>MIELNIK, Michal Marek ; ANDREASSEN, Erik ; TOFTEBERG, Terje Rosquist</creatorcontrib><description>A lab-on-a-chip system, and a method for fabrication of a lab-on-a-chip system. The system comprises a chip having a fluid port and being overmoulded by a moulding material in at least an area surrounding the fluid port, and having moulding material extending away from the chip, said moulding material extending away from the chip having in a first surface overlying at least part of the chip a fluid channel in communication with the fluid port of the chip, and the chip has one or more of:
- a ledge or ledges along the sides thereof, and the ledge or ledges being overmoulded by said moulding material for securing the chip, and
- an area of the chip surrounding the fluid port comprises one or more of trenches, roughened surface, and treated surface, for enhancing adherence of moulding material on that area to the chip.</description><language>eng ; fre ; ger</language><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING ; BASIC ELECTRIC ELEMENTS ; CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS ; PERFORMING OPERATIONS ; PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL ; SEMICONDUCTOR DEVICES ; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR ; SHAPING OR JOINING OF PLASTICS ; TRANSPORTING ; WORKING OF PLASTICS ; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190424&DB=EPODOC&CC=EP&NR=2992550B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,778,883,25547,76298</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20190424&DB=EPODOC&CC=EP&NR=2992550B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIELNIK, Michal Marek</creatorcontrib><creatorcontrib>ANDREASSEN, Erik</creatorcontrib><creatorcontrib>TOFTEBERG, Terje Rosquist</creatorcontrib><title>A LAB-ON-A-CHIP FABRICATION METHOD</title><description>A lab-on-a-chip system, and a method for fabrication of a lab-on-a-chip system. The system comprises a chip having a fluid port and being overmoulded by a moulding material in at least an area surrounding the fluid port, and having moulding material extending away from the chip, said moulding material extending away from the chip having in a first surface overlying at least part of the chip a fluid channel in communication with the fluid port of the chip, and the chip has one or more of:
- a ledge or ledges along the sides thereof, and the ledge or ledges being overmoulded by said moulding material for securing the chip, and
- an area of the chip surrounding the fluid port comprises one or more of trenches, roughened surface, and treated surface, for enhancing adherence of moulding material on that area to the chip.</description><subject>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS</subject><subject>PERFORMING OPERATIONS</subject><subject>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</subject><subject>SHAPING OR JOINING OF PLASTICS</subject><subject>TRANSPORTING</subject><subject>WORKING OF PLASTICS</subject><subject>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFByVPBxdNL199N11HX28AxQcHN0CvJ0dgzx9PdT8HUN8fB34WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BRpaWRqamBk6GxkQoAQC60yGP</recordid><startdate>20190424</startdate><enddate>20190424</enddate><creator>MIELNIK, Michal Marek</creator><creator>ANDREASSEN, Erik</creator><creator>TOFTEBERG, Terje Rosquist</creator><scope>EVB</scope></search><sort><creationdate>20190424</creationdate><title>A LAB-ON-A-CHIP FABRICATION METHOD</title><author>MIELNIK, Michal Marek ; ANDREASSEN, Erik ; TOFTEBERG, Terje Rosquist</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2992550B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2019</creationdate><topic>AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS</topic><topic>PERFORMING OPERATIONS</topic><topic>PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR</topic><topic>SHAPING OR JOINING OF PLASTICS</topic><topic>TRANSPORTING</topic><topic>WORKING OF PLASTICS</topic><topic>WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL</topic><toplevel>online_resources</toplevel><creatorcontrib>MIELNIK, Michal Marek</creatorcontrib><creatorcontrib>ANDREASSEN, Erik</creatorcontrib><creatorcontrib>TOFTEBERG, Terje Rosquist</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIELNIK, Michal Marek</au><au>ANDREASSEN, Erik</au><au>TOFTEBERG, Terje Rosquist</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>A LAB-ON-A-CHIP FABRICATION METHOD</title><date>2019-04-24</date><risdate>2019</risdate><abstract>A lab-on-a-chip system, and a method for fabrication of a lab-on-a-chip system. The system comprises a chip having a fluid port and being overmoulded by a moulding material in at least an area surrounding the fluid port, and having moulding material extending away from the chip, said moulding material extending away from the chip having in a first surface overlying at least part of the chip a fluid channel in communication with the fluid port of the chip, and the chip has one or more of:
- a ledge or ledges along the sides thereof, and the ledge or ledges being overmoulded by said moulding material for securing the chip, and
- an area of the chip surrounding the fluid port comprises one or more of trenches, roughened surface, and treated surface, for enhancing adherence of moulding material on that area to the chip.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; ger |
| recordid | cdi_epo_espacenet_EP2992550B1 |
| source | esp@cenet |
| subjects | AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING BASIC ELECTRIC ELEMENTS CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS PERFORMING OPERATIONS PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL SEMICONDUCTOR DEVICES SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR SHAPING OR JOINING OF PLASTICS TRANSPORTING WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL |
| title | A LAB-ON-A-CHIP FABRICATION METHOD |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-16T15%3A46%3A49IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=MIELNIK,%20Michal%20Marek&rft.date=2019-04-24&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP2992550B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |