MANAGEMENT OF EXTERIOR TEMPERATURES ENCOUNTERED BY USER OF A PORTABLE ELECTRONIC DEVICE USING MULTIPLE HEAT-REJECTION ELEMENTS

Described embodiments include a portable electronic device. The device includes a shell and a heat-generating component. The device includes a first and a second exterior heat-rejection element. Each heat-rejection element is configured to reject heat received from the heat-generating component into...

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Hauptverfasser: TREMBLAY, MARC, HYDE, RODERICK, A, WHITMER, CHARLES, BARNES, PHILIP, LIONEL, TUCKERMAN, DAVID, B, PASCH, NICHOLAS, F, LORD, RICHARD, T, WOOD, LOWELL L., JR, MYHRVOLD, NATHAN, P, LORD, ROBERT, W, TEGREENE, CLARENCE, T, CHIN, HON, WAH, ISHIKAWA, MURIEL, Y, MUNDIE, CRAIG, J, KARE, JORDIN, T, DAVIDSON, HOWARD, L, HALLMAN, KIMBERLY, D., A, LEE, BRIAN, RUDDER, ERIC, D
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Sprache:eng ; fre ; ger
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creator TREMBLAY, MARC
HYDE, RODERICK, A
WHITMER, CHARLES
BARNES, PHILIP, LIONEL
TUCKERMAN, DAVID, B
PASCH, NICHOLAS, F
LORD, RICHARD, T
WOOD, LOWELL L., JR
MYHRVOLD, NATHAN, P
LORD, ROBERT, W
TEGREENE, CLARENCE, T
CHIN, HON, WAH
ISHIKAWA, MURIEL, Y
MUNDIE, CRAIG, J
KARE, JORDIN, T
DAVIDSON, HOWARD, L
HALLMAN, KIMBERLY, D., A
LEE, BRIAN
RUDDER, ERIC, D
description Described embodiments include a portable electronic device. The device includes a shell and a heat-generating component. The device includes a first and a second exterior heat-rejection element. Each heat-rejection element is configured to reject heat received from the heat-generating component into an environment. The device includes a controllable thermal coupler configured to regulate heat transfer to the first and second heat-rejection elements. The device includes a first proximity sensor configured to determine if a user touch to the shell is within a first zone of possible heat discomfort. The device includes a thermal manager configured to regulate heat transfer by the controllable thermal coupler to the first and second heat-rejection elements. The regulated heat transfer includes adjusting heat rejection away from the first heat-rejection element and toward the second heat-rejection element if the user touch is within the first zone.
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The device includes a shell and a heat-generating component. The device includes a first and a second exterior heat-rejection element. Each heat-rejection element is configured to reject heat received from the heat-generating component into an environment. The device includes a controllable thermal coupler configured to regulate heat transfer to the first and second heat-rejection elements. The device includes a first proximity sensor configured to determine if a user touch to the shell is within a first zone of possible heat discomfort. The device includes a thermal manager configured to regulate heat transfer by the controllable thermal coupler to the first and second heat-rejection elements. 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HYDE, RODERICK, A ; WHITMER, CHARLES ; BARNES, PHILIP, LIONEL ; TUCKERMAN, DAVID, B ; PASCH, NICHOLAS, F ; LORD, RICHARD, T ; WOOD, LOWELL L., JR ; MYHRVOLD, NATHAN, P ; LORD, ROBERT, W ; TEGREENE, CLARENCE, T ; CHIN, HON, WAH ; ISHIKAWA, MURIEL, Y ; MUNDIE, CRAIG, J ; KARE, JORDIN, T ; DAVIDSON, HOWARD, L ; HALLMAN, KIMBERLY, D., A ; LEE, BRIAN ; RUDDER, ERIC, D</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2974577A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2016</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>CALCULATING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COMPUTING</topic><topic>COUNTING</topic><topic>ELECTRIC COMMUNICATION TECHNIQUE</topic><topic>ELECTRIC DIGITAL DATA PROCESSING</topic><topic>ELECTRIC HEATING</topic><topic>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MECHANICAL ENGINEERING</topic><topic>PHYSICS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSMISSION</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>TREMBLAY, MARC</creatorcontrib><creatorcontrib>HYDE, RODERICK, A</creatorcontrib><creatorcontrib>WHITMER, CHARLES</creatorcontrib><creatorcontrib>BARNES, PHILIP, LIONEL</creatorcontrib><creatorcontrib>TUCKERMAN, DAVID, B</creatorcontrib><creatorcontrib>PASCH, NICHOLAS, F</creatorcontrib><creatorcontrib>LORD, RICHARD, T</creatorcontrib><creatorcontrib>WOOD, LOWELL L., JR</creatorcontrib><creatorcontrib>MYHRVOLD, NATHAN, P</creatorcontrib><creatorcontrib>LORD, ROBERT, W</creatorcontrib><creatorcontrib>TEGREENE, CLARENCE, T</creatorcontrib><creatorcontrib>CHIN, HON, WAH</creatorcontrib><creatorcontrib>ISHIKAWA, MURIEL, Y</creatorcontrib><creatorcontrib>MUNDIE, CRAIG, J</creatorcontrib><creatorcontrib>KARE, JORDIN, T</creatorcontrib><creatorcontrib>DAVIDSON, HOWARD, L</creatorcontrib><creatorcontrib>HALLMAN, KIMBERLY, D., A</creatorcontrib><creatorcontrib>LEE, BRIAN</creatorcontrib><creatorcontrib>RUDDER, ERIC, D</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TREMBLAY, MARC</au><au>HYDE, RODERICK, A</au><au>WHITMER, CHARLES</au><au>BARNES, PHILIP, LIONEL</au><au>TUCKERMAN, DAVID, B</au><au>PASCH, NICHOLAS, F</au><au>LORD, RICHARD, T</au><au>WOOD, LOWELL L., JR</au><au>MYHRVOLD, NATHAN, P</au><au>LORD, ROBERT, W</au><au>TEGREENE, CLARENCE, T</au><au>CHIN, HON, WAH</au><au>ISHIKAWA, MURIEL, Y</au><au>MUNDIE, CRAIG, J</au><au>KARE, JORDIN, T</au><au>DAVIDSON, HOWARD, L</au><au>HALLMAN, KIMBERLY, D., A</au><au>LEE, BRIAN</au><au>RUDDER, ERIC, D</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>MANAGEMENT OF EXTERIOR TEMPERATURES ENCOUNTERED BY USER OF A PORTABLE ELECTRONIC DEVICE USING MULTIPLE HEAT-REJECTION ELEMENTS</title><date>2016-01-20</date><risdate>2016</risdate><abstract>Described embodiments include a portable electronic device. The device includes a shell and a heat-generating component. The device includes a first and a second exterior heat-rejection element. Each heat-rejection element is configured to reject heat received from the heat-generating component into an environment. The device includes a controllable thermal coupler configured to regulate heat transfer to the first and second heat-rejection elements. The device includes a first proximity sensor configured to determine if a user touch to the shell is within a first zone of possible heat discomfort. The device includes a thermal manager configured to regulate heat transfer by the controllable thermal coupler to the first and second heat-rejection elements. The regulated heat transfer includes adjusting heat rejection away from the first heat-rejection element and toward the second heat-rejection element if the user touch is within the first zone.</abstract><oa>free_for_read</oa></addata></record>
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language eng ; fre ; ger
recordid cdi_epo_espacenet_EP2974577A1
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
BLASTING
CALCULATING
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
COMPUTING
COUNTING
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRIC DIGITAL DATA PROCESSING
ELECTRIC HEATING
ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HEAT EXCHANGE IN GENERAL
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
HEATING
LIGHTING
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MECHANICAL ENGINEERING
PHYSICS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
TRANSMISSION
WEAPONS
title MANAGEMENT OF EXTERIOR TEMPERATURES ENCOUNTERED BY USER OF A PORTABLE ELECTRONIC DEVICE USING MULTIPLE HEAT-REJECTION ELEMENTS
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