Method of attaching electronic components by soldering with removal of substrate oxide coating using a flux, corresponding substrate and corresponding flip-chip component
A method of attaching an electronic component (202) to a metal substrate (204) such as a lead frame, wherein the electronic component (202) comprises an exposed solder region comprising a solder bump (206) and flux (208) thereon, the method comprising: forming a metal-based compound layer (210) (a m...
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| creator | WALCZYK,, SVEN ELTINK,, ERIK DE BEER,, JOHAN RENE MAVINKURVE,, AMAR |
| description | A method of attaching an electronic component (202) to a metal substrate (204) such as a lead frame, wherein the electronic component (202) comprises an exposed solder region comprising a solder bump (206) and flux (208) thereon, the method comprising: forming a metal-based compound layer (210) (a metal oxide, metal sulphide or metal nitride layer) on the metal substrate (204); placing the electronic component (202) on the metal substrate (204) such that the solder region is in contact with a contact region of the metal-based compound layer (210); and heating the solder region such that the contact region of the metal-based compound layer (210) dissolves under the influence of the flux (208) and the reflowed solder bump (206) forms an electrical connection between the electronic component (202) and the metal substrate (204). The metal-based compound layer (210) can have a minimum thickness of 10 nm. The provision of the metal-based compound layer (210) on the metal substrate (204) may prevent or reduce excessive flow-out of flux (208) and/or solder (206) during heating in the reflow process. |
| format | Patent |
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The metal-based compound layer (210) can have a minimum thickness of 10 nm. The provision of the metal-based compound layer (210) on the metal substrate (204) may prevent or reduce excessive flow-out of flux (208) and/or solder (206) during heating in the reflow process.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2016</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160113&DB=EPODOC&CC=EP&NR=2966677A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76418</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20160113&DB=EPODOC&CC=EP&NR=2966677A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WALCZYK,, SVEN</creatorcontrib><creatorcontrib>ELTINK,, ERIK</creatorcontrib><creatorcontrib>DE BEER,, JOHAN RENE</creatorcontrib><creatorcontrib>MAVINKURVE,, AMAR</creatorcontrib><title>Method of attaching electronic components by soldering with removal of substrate oxide coating using a flux, corresponding substrate and corresponding flip-chip component</title><description>A method of attaching an electronic component (202) to a metal substrate (204) such as a lead frame, wherein the electronic component (202) comprises an exposed solder region comprising a solder bump (206) and flux (208) thereon, the method comprising: forming a metal-based compound layer (210) (a metal oxide, metal sulphide or metal nitride layer) on the metal substrate (204); placing the electronic component (202) on the metal substrate (204) such that the solder region is in contact with a contact region of the metal-based compound layer (210); and heating the solder region such that the contact region of the metal-based compound layer (210) dissolves under the influence of the flux (208) and the reflowed solder bump (206) forms an electrical connection between the electronic component (202) and the metal substrate (204). The metal-based compound layer (210) can have a minimum thickness of 10 nm. 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The metal-based compound layer (210) can have a minimum thickness of 10 nm. The provision of the metal-based compound layer (210) on the metal substrate (204) may prevent or reduce excessive flow-out of flux (208) and/or solder (206) during heating in the reflow process.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | Method of attaching electronic components by soldering with removal of substrate oxide coating using a flux, corresponding substrate and corresponding flip-chip component |
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