PLATING METHOD

Copper electroplating baths having a surface tension of ¤ 40 mN/m are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.

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Bibliographische Detailangaben
Hauptverfasser:	THORSETH, MATTHEW A, GOMEZ, LUIS A, SCALISI, MARK A, HAZEBROUCK, REBECCA LEA, LIEB, BRYAN, LEFEBVRE, MARK
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	Copper electroplating baths having a surface tension of ¤ 40 mN/m are suitable for filling vias with copper, where such copper deposits are substantially void-free and substantially free of surface defects.