METHOD FOR PRODUCING A HEAT SINK, AND HEAT SINK FOR ELECTRICAL COMPONENTS

The invention relates to a method for producing a heat sink (1) from aluminium for cooling and fixing electronic and/or electrical components, comprising substantially a base plate (2) with projecting cooling parts (23) and, opposite the latter, at least one contact area (25) for thermally coupling...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	WOLFF, Roland
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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