METHOD FOR PRODUCING A HEAT SINK, AND HEAT SINK FOR ELECTRICAL COMPONENTS

METHOD FOR PRODUCING A HEAT SINK, AND HEAT SINK FOR ELECTRICAL COMPONENTS

The invention relates to a method for producing a heat sink (1) from aluminium for cooling and fixing electronic and/or electrical components, comprising substantially a base plate (2) with projecting cooling parts (23) and, opposite the latter, at least one contact area (25) for thermally coupling...

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1. Verfasser: WOLFF, Roland
Format: Patent
Sprache:eng ; fre ; ger
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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creator WOLFF, Roland
description The invention relates to a method for producing a heat sink (1) from aluminium for cooling and fixing electronic and/or electrical components, comprising substantially a base plate (2) with projecting cooling parts (23) and, opposite the latter, at least one contact area (25) for thermally coupling parts to be cooled, and relates to said heat sink. In order to meet the technical requirement for heat sinks (1) with large contact areas (25) and with a high uniform cooling effect thereof, the invention provides for individual segment plates (21) of a base plate (1) to be produced from a starting material in a first step by means of pressure forming according to DIN 8583 while the cooling parts (23, 24) which project therefrom are being formed, whereupon at least two base plate individual segments (21) are clamped with the side surfaces (22) resting against one another and are metallically connected in a melt-free manner in a second step, whereupon the large-area heat sink (1) is finished in a subsequent step with the formation of the contact area(s) (25).
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP2962328B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP2962328B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP2962328B13</originalsourceid><addsrcrecordid>eNrjZPD0dQ3x8HdRcPMPUggI8ncJdfb0c1dwVPBwdQxRCPb089ZRcPRzQXDBCl19XJ1DgjydHX0UnP19A_z9XP1CgnkYWNMSc4pTeaE0N4OCm2uIs4duakF-fGpxQWJyal5qSbxrgJGlmZGxkYWToTERSgCUjixA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR PRODUCING A HEAT SINK, AND HEAT SINK FOR ELECTRICAL COMPONENTS</title><source>esp@cenet</source><creator>WOLFF, Roland</creator><creatorcontrib>WOLFF, Roland</creatorcontrib><description>The invention relates to a method for producing a heat sink (1) from aluminium for cooling and fixing electronic and/or electrical components, comprising substantially a base plate (2) with projecting cooling parts (23) and, opposite the latter, at least one contact area (25) for thermally coupling parts to be cooled, and relates to said heat sink. In order to meet the technical requirement for heat sinks (1) with large contact areas (25) and with a high uniform cooling effect thereof, the invention provides for individual segment plates (21) of a base plate (1) to be produced from a starting material in a first step by means of pressure forming according to DIN 8583 while the cooling parts (23, 24) which project therefrom are being formed, whereupon at least two base plate individual segments (21) are clamped with the side surfaces (22) resting against one another and are metallically connected in a melt-free manner in a second step, whereupon the large-area heat sink (1) is finished in a subsequent step with the formation of the contact area(s) (25).</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2022</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220209&amp;DB=EPODOC&amp;CC=EP&amp;NR=2962328B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,777,882,25545,76296</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20220209&amp;DB=EPODOC&amp;CC=EP&amp;NR=2962328B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>WOLFF, Roland</creatorcontrib><title>METHOD FOR PRODUCING A HEAT SINK, AND HEAT SINK FOR ELECTRICAL COMPONENTS</title><description>The invention relates to a method for producing a heat sink (1) from aluminium for cooling and fixing electronic and/or electrical components, comprising substantially a base plate (2) with projecting cooling parts (23) and, opposite the latter, at least one contact area (25) for thermally coupling parts to be cooled, and relates to said heat sink. In order to meet the technical requirement for heat sinks (1) with large contact areas (25) and with a high uniform cooling effect thereof, the invention provides for individual segment plates (21) of a base plate (1) to be produced from a starting material in a first step by means of pressure forming according to DIN 8583 while the cooling parts (23, 24) which project therefrom are being formed, whereupon at least two base plate individual segments (21) are clamped with the side surfaces (22) resting against one another and are metallically connected in a melt-free manner in a second step, whereupon the large-area heat sink (1) is finished in a subsequent step with the formation of the contact area(s) (25).</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2022</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPD0dQ3x8HdRcPMPUggI8ncJdfb0c1dwVPBwdQxRCPb089ZRcPRzQXDBCl19XJ1DgjydHX0UnP19A_z9XP1CgnkYWNMSc4pTeaE0N4OCm2uIs4duakF-fGpxQWJyal5qSbxrgJGlmZGxkYWToTERSgCUjixA</recordid><startdate>20220209</startdate><enddate>20220209</enddate><creator>WOLFF, Roland</creator><scope>EVB</scope></search><sort><creationdate>20220209</creationdate><title>METHOD FOR PRODUCING A HEAT SINK, AND HEAT SINK FOR ELECTRICAL COMPONENTS</title><author>WOLFF, Roland</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2962328B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2022</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>WOLFF, Roland</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>WOLFF, Roland</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR PRODUCING A HEAT SINK, AND HEAT SINK FOR ELECTRICAL COMPONENTS</title><date>2022-02-09</date><risdate>2022</risdate><abstract>The invention relates to a method for producing a heat sink (1) from aluminium for cooling and fixing electronic and/or electrical components, comprising substantially a base plate (2) with projecting cooling parts (23) and, opposite the latter, at least one contact area (25) for thermally coupling parts to be cooled, and relates to said heat sink. In order to meet the technical requirement for heat sinks (1) with large contact areas (25) and with a high uniform cooling effect thereof, the invention provides for individual segment plates (21) of a base plate (1) to be produced from a starting material in a first step by means of pressure forming according to DIN 8583 while the cooling parts (23, 24) which project therefrom are being formed, whereupon at least two base plate individual segments (21) are clamped with the side surfaces (22) resting against one another and are metallically connected in a melt-free manner in a second step, whereupon the large-area heat sink (1) is finished in a subsequent step with the formation of the contact area(s) (25).</abstract><oa>free_for_read</oa></addata></record>
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language eng ; fre ; ger
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title METHOD FOR PRODUCING A HEAT SINK, AND HEAT SINK FOR ELECTRICAL COMPONENTS
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-20T09%3A07%3A46IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=WOLFF,%20Roland&rft.date=2022-02-09&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP2962328B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true