SOLID-STATE IMAGE PICKUP DEVICE AND METHOD FOR MANUFACTURING SOLID-STATE IMAGE PICKUP DEVICE

A solid-state imaging device 1 includes a light receiving section 2 formed by such exposure as to stitch a plurality of patterns 2A, 2B in a Y-axis direction on a semiconductor substrate. The light receiving section 2 includes a plurality of pixels disposed in a two-dimensional array in the Y-axis d...

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Bibliographische Detailangaben
Hauptverfasser:	SUZUKI Hisanori, MURAMATSU Masaharu
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC COMMUNICATION TECHNIQUE ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY PICTORIAL COMMUNICATION, e.g. TELEVISION SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A solid-state imaging device 1 includes a light receiving section 2 formed by such exposure as to stitch a plurality of patterns 2A, 2B in a Y-axis direction on a semiconductor substrate. The light receiving section 2 includes a plurality of pixels disposed in a two-dimensional array in the Y-axis direction and an X-axis direction perpendicular to the Y-axis direction. Electric charges are transferred in the X-axis direction in each of pixel columns consisting of a plurality of pixels disposed in the X-axis direction, among the plurality of pixels.