LAMINATED GLASS
Cracking of a laminated glass assembly having a device encapsulated therein during the manufacturing process is prevented. The laminated glass assembly (1) comprises a first and a second glass sheet (3, 4); a first, a second and a third intermediate film (6, 7, 8) interposed between the first and se...
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| creator | ASAOKA, Hisashi CHAMBERLAIN, Mark A OGAWA, Hisashi |
| description | Cracking of a laminated glass assembly having a device encapsulated therein during the manufacturing process is prevented. The laminated glass assembly (1) comprises a first and a second glass sheet (3, 4); a first, a second and a third intermediate film (6, 7, 8) interposed between the first and second glass sheets, in that order; an organic EL panel (2) interposed between the first and second intermediate films and provided with a terminal member (13); and a first wiring member (18) consisting of a metallic thin strip connected to the terminal member in a thickness-wise direction via a first solder (21); wherein at least one of the two glass sheets has a thickness of 1.0 mm to 1.6 mm; and at a connecting portion of the terminal member, the first solder and the first wiring member, the first wiring member has a thickness of 0.05 mm to 0.10 mm and a width of 3 mm to 15 mm, and the first solder has a thickness of 0.01 mm to 0.20 mm; and a total thickness of the terminal member, the first solder and the first wiring member is 0.16 mm to 0.40 mm. |
| format | Patent |
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The laminated glass assembly (1) comprises a first and a second glass sheet (3, 4); a first, a second and a third intermediate film (6, 7, 8) interposed between the first and second glass sheets, in that order; an organic EL panel (2) interposed between the first and second intermediate films and provided with a terminal member (13); and a first wiring member (18) consisting of a metallic thin strip connected to the terminal member in a thickness-wise direction via a first solder (21); wherein at least one of the two glass sheets has a thickness of 1.0 mm to 1.6 mm; and at a connecting portion of the terminal member, the first solder and the first wiring member, the first wiring member has a thickness of 0.05 mm to 0.10 mm and a width of 3 mm to 15 mm, and the first solder has a thickness of 0.01 mm to 0.20 mm; and a total thickness of the terminal member, the first solder and the first wiring member is 0.16 mm to 0.40 mm.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS ; CHEMISTRY ; CURRENT COLLECTORS ; ELECTRIC HEATING ; ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GLASS ; JOINING GLASS TO GLASS OR OTHER MATERIALS ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; LINE CONNECTORS ; METALLURGY ; MINERAL OR SLAG WOOL ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS ; SURFACE TREATMENT OF GLASS ; TRANSPORTING</subject><creationdate>2021</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210217&DB=EPODOC&CC=EP&NR=2955164B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20210217&DB=EPODOC&CC=EP&NR=2955164B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ASAOKA, Hisashi</creatorcontrib><creatorcontrib>CHAMBERLAIN, Mark A</creatorcontrib><creatorcontrib>OGAWA, Hisashi</creatorcontrib><title>LAMINATED GLASS</title><description>Cracking of a laminated glass assembly having a device encapsulated therein during the manufacturing process is prevented. The laminated glass assembly (1) comprises a first and a second glass sheet (3, 4); a first, a second and a third intermediate film (6, 7, 8) interposed between the first and second glass sheets, in that order; an organic EL panel (2) interposed between the first and second intermediate films and provided with a terminal member (13); and a first wiring member (18) consisting of a metallic thin strip connected to the terminal member in a thickness-wise direction via a first solder (21); wherein at least one of the two glass sheets has a thickness of 1.0 mm to 1.6 mm; and at a connecting portion of the terminal member, the first solder and the first wiring member, the first wiring member has a thickness of 0.05 mm to 0.10 mm and a width of 3 mm to 15 mm, and the first solder has a thickness of 0.01 mm to 0.20 mm; and a total thickness of the terminal member, the first solder and the first wiring member is 0.16 mm to 0.40 mm.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</subject><subject>CHEMISTRY</subject><subject>CURRENT COLLECTORS</subject><subject>ELECTRIC HEATING</subject><subject>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GLASS</subject><subject>JOINING GLASS TO GLASS OR OTHER MATERIALS</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>LINE CONNECTORS</subject><subject>METALLURGY</subject><subject>MINERAL OR SLAG WOOL</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</subject><subject>SURFACE TREATMENT OF GLASS</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2021</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOD3cfT19HMMcXVRcPdxDA7mYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgFGlqamhmYmTobGRCgBAKfAHMk</recordid><startdate>20210217</startdate><enddate>20210217</enddate><creator>ASAOKA, Hisashi</creator><creator>CHAMBERLAIN, Mark A</creator><creator>OGAWA, Hisashi</creator><scope>EVB</scope></search><sort><creationdate>20210217</creationdate><title>LAMINATED GLASS</title><author>ASAOKA, Hisashi ; CHAMBERLAIN, Mark A ; OGAWA, Hisashi</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2955164B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2021</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS</topic><topic>CHEMISTRY</topic><topic>CURRENT COLLECTORS</topic><topic>ELECTRIC HEATING</topic><topic>ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GLASS</topic><topic>JOINING GLASS TO GLASS OR OTHER MATERIALS</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>LINE CONNECTORS</topic><topic>METALLURGY</topic><topic>MINERAL OR SLAG WOOL</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS</topic><topic>SURFACE TREATMENT OF GLASS</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>ASAOKA, Hisashi</creatorcontrib><creatorcontrib>CHAMBERLAIN, Mark A</creatorcontrib><creatorcontrib>OGAWA, Hisashi</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ASAOKA, Hisashi</au><au>CHAMBERLAIN, Mark A</au><au>OGAWA, Hisashi</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LAMINATED GLASS</title><date>2021-02-17</date><risdate>2021</risdate><abstract>Cracking of a laminated glass assembly having a device encapsulated therein during the manufacturing process is prevented. The laminated glass assembly (1) comprises a first and a second glass sheet (3, 4); a first, a second and a third intermediate film (6, 7, 8) interposed between the first and second glass sheets, in that order; an organic EL panel (2) interposed between the first and second intermediate films and provided with a terminal member (13); and a first wiring member (18) consisting of a metallic thin strip connected to the terminal member in a thickness-wise direction via a first solder (21); wherein at least one of the two glass sheets has a thickness of 1.0 mm to 1.6 mm; and at a connecting portion of the terminal member, the first solder and the first wiring member, the first wiring member has a thickness of 0.05 mm to 0.10 mm and a width of 3 mm to 15 mm, and the first solder has a thickness of 0.01 mm to 0.20 mm; and a total thickness of the terminal member, the first solder and the first wiring member is 0.16 mm to 0.40 mm.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | BASIC ELECTRIC ELEMENTS CHEMICAL COMPOSITION OF GLASSES, GLAZES, OR VITREOUSENAMELS CHEMISTRY CURRENT COLLECTORS ELECTRIC HEATING ELECTRIC LIGHTING NOT OTHERWISE PROVIDED FOR ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GLASS JOINING GLASS TO GLASS OR OTHER MATERIALS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM LINE CONNECTORS METALLURGY MINERAL OR SLAG WOOL PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS,MINERALS OR SLAGS SURFACE TREATMENT OF GLASS TRANSPORTING |
| title | LAMINATED GLASS |
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