PCB HAVING OFFSET DIFFERENTIAL SIGNAL ROUTING

In accordance with the various embodiments disclosed herein, an improved electrical connector footprints, such as printed circuit boards (printed circuit board), is described comprising one or more of, for example, a first linear array containing at least a first anti-pad extending along a first dir...

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1. Verfasser: MINICH, STEVEN E
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creator MINICH, STEVEN E
description In accordance with the various embodiments disclosed herein, an improved electrical connector footprints, such as printed circuit boards (printed circuit board), is described comprising one or more of, for example, a first linear array containing at least a first anti-pad extending along a first direction, a first electrical signal trace extending along the first direction and spaced from the first linear array along a second direction that is perpendicular to the first direction, a group of ground isolation vias containing at least one electrically conductive ground via arranged along a line extending parallel to the first direction and spaced from the first electrical signal trace along the second direction, and a second linear array containing at least a second anti-pad extending along the first direction spaced from the group of ground isolation vias along the second direction.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP2952074A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP2952074A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP2952074A13</originalsourceid><addsrcrecordid>eNrjZNANcHZS8HAM8_RzV_B3cwt2DVFw8XRzcw1y9QvxdPRRCPZ09wNSQf6hIUAlPAysaYk5xam8UJqbQcHNNcTZQze1ID8-tbggMTk1L7Uk3jXAyNLUyMDcxNHQmAglAGn4JQI</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PCB HAVING OFFSET DIFFERENTIAL SIGNAL ROUTING</title><source>esp@cenet</source><creator>MINICH, STEVEN E</creator><creatorcontrib>MINICH, STEVEN E</creatorcontrib><description>In accordance with the various embodiments disclosed herein, an improved electrical connector footprints, such as printed circuit boards (printed circuit board), is described comprising one or more of, for example, a first linear array containing at least a first anti-pad extending along a first direction, a first electrical signal trace extending along the first direction and spaced from the first linear array along a second direction that is perpendicular to the first direction, a group of ground isolation vias containing at least one electrically conductive ground via arranged along a line extending parallel to the first direction and spaced from the first electrical signal trace along the second direction, and a second linear array containing at least a second anti-pad extending along the first direction spaced from the group of ground isolation vias along the second direction.</description><language>eng ; fre ; ger</language><subject>ADVERTISING ; APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND,DEAF OR MUTE ; BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CRYPTOGRAPHY ; CURRENT COLLECTORS ; DIAGRAMS ; DISPLAY ; EDUCATION ; EDUCATIONAL OR DEMONSTRATION APPLIANCES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GLOBES ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PHYSICS ; PLANETARIA ; PRINTED CIRCUITS ; SEALS</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20151209&amp;DB=EPODOC&amp;CC=EP&amp;NR=2952074A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76516</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20151209&amp;DB=EPODOC&amp;CC=EP&amp;NR=2952074A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MINICH, STEVEN E</creatorcontrib><title>PCB HAVING OFFSET DIFFERENTIAL SIGNAL ROUTING</title><description>In accordance with the various embodiments disclosed herein, an improved electrical connector footprints, such as printed circuit boards (printed circuit board), is described comprising one or more of, for example, a first linear array containing at least a first anti-pad extending along a first direction, a first electrical signal trace extending along the first direction and spaced from the first linear array along a second direction that is perpendicular to the first direction, a group of ground isolation vias containing at least one electrically conductive ground via arranged along a line extending parallel to the first direction and spaced from the first electrical signal trace along the second direction, and a second linear array containing at least a second anti-pad extending along the first direction spaced from the group of ground isolation vias along the second direction.</description><subject>ADVERTISING</subject><subject>APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND,DEAF OR MUTE</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CRYPTOGRAPHY</subject><subject>CURRENT COLLECTORS</subject><subject>DIAGRAMS</subject><subject>DISPLAY</subject><subject>EDUCATION</subject><subject>EDUCATIONAL OR DEMONSTRATION APPLIANCES</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GLOBES</subject><subject>LINE CONNECTORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PHYSICS</subject><subject>PLANETARIA</subject><subject>PRINTED CIRCUITS</subject><subject>SEALS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNANcHZS8HAM8_RzV_B3cwt2DVFw8XRzcw1y9QvxdPRRCPZ09wNSQf6hIUAlPAysaYk5xam8UJqbQcHNNcTZQze1ID8-tbggMTk1L7Uk3jXAyNLUyMDcxNHQmAglAGn4JQI</recordid><startdate>20151209</startdate><enddate>20151209</enddate><creator>MINICH, STEVEN E</creator><scope>EVB</scope></search><sort><creationdate>20151209</creationdate><title>PCB HAVING OFFSET DIFFERENTIAL SIGNAL ROUTING</title><author>MINICH, STEVEN E</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2952074A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2015</creationdate><topic>ADVERTISING</topic><topic>APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND,DEAF OR MUTE</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CRYPTOGRAPHY</topic><topic>CURRENT COLLECTORS</topic><topic>DIAGRAMS</topic><topic>DISPLAY</topic><topic>EDUCATION</topic><topic>EDUCATIONAL OR DEMONSTRATION APPLIANCES</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GLOBES</topic><topic>LINE CONNECTORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PHYSICS</topic><topic>PLANETARIA</topic><topic>PRINTED CIRCUITS</topic><topic>SEALS</topic><toplevel>online_resources</toplevel><creatorcontrib>MINICH, STEVEN E</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MINICH, STEVEN E</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PCB HAVING OFFSET DIFFERENTIAL SIGNAL ROUTING</title><date>2015-12-09</date><risdate>2015</risdate><abstract>In accordance with the various embodiments disclosed herein, an improved electrical connector footprints, such as printed circuit boards (printed circuit board), is described comprising one or more of, for example, a first linear array containing at least a first anti-pad extending along a first direction, a first electrical signal trace extending along the first direction and spaced from the first linear array along a second direction that is perpendicular to the first direction, a group of ground isolation vias containing at least one electrically conductive ground via arranged along a line extending parallel to the first direction and spaced from the first electrical signal trace along the second direction, and a second linear array containing at least a second anti-pad extending along the first direction spaced from the group of ground isolation vias along the second direction.</abstract><oa>free_for_read</oa></addata></record>
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language eng ; fre ; ger
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subjects ADVERTISING
APPLIANCES FOR TEACHING, OR COMMUNICATING WITH, THE BLIND,DEAF OR MUTE
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CRYPTOGRAPHY
CURRENT COLLECTORS
DIAGRAMS
DISPLAY
EDUCATION
EDUCATIONAL OR DEMONSTRATION APPLIANCES
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
GLOBES
LINE CONNECTORS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PHYSICS
PLANETARIA
PRINTED CIRCUITS
SEALS
title PCB HAVING OFFSET DIFFERENTIAL SIGNAL ROUTING
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