HEAT EXCHANGER AND METHOD FOR MANUFACTURING SAME
In the present invention, the manufacturing process is simplified, the weight and cost are reduced, and a safe and reliable structure is produced by using a generic metal plate. In a heat exchanger according to the present invention, thin metal plates of a predetermined thickness, which have outer s...
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creator | NARITOMI, MASANORI OGAWA, NORITAKA |
description | In the present invention, the manufacturing process is simplified, the weight and cost are reduced, and a safe and reliable structure is produced by using a generic metal plate. In a heat exchanger according to the present invention, thin metal plates of a predetermined thickness, which have outer surfaces 4a, 5a that are to be positioned on the side of electronic components 3 - objects of heat exchange -, and which have resin-coated inner surfaces 4b, 5b, are press-worked to a predetermined shape, whereby a first molded body 4 and a second molded body 5 are formed. The two molded bodies are combined so that the inner surfaces 4b, 5b thereof face each other, and the inner surface 4c at the edge portion 4c and the inner surface 5b at the edge portion 5c are thermally fused together by hot press-working. The edge portions 4c, 5c are performed to ultrafine processing and then inserted into a die, and a thermoplastic resin composition is injected into the cavity of the die, whereby a joining member 6 is molded. A space 7 created by the combining has a supply port 10 and a discharge port 11 and serves as a fluid passage for a heat medium 8. A heat exchanger 1 has such a structure, the outer surfaces 4a, 5a are brought into contact with electronic components 3, and heat exchange is performed with the heat medium flowing through the fluid passage. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP2947412A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP2947412A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP2947412A13</originalsourceid><addsrcrecordid>eNrjZDDwcHUMUXCNcPZw9HN3DVJw9HNR8HUN8fB3UXDzD1LwdfQLdXN0DgkN8vRzVwh29HXlYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgFGlibmJoZGjobGRCgBAMVYJaU</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HEAT EXCHANGER AND METHOD FOR MANUFACTURING SAME</title><source>esp@cenet</source><creator>NARITOMI, MASANORI ; OGAWA, NORITAKA</creator><creatorcontrib>NARITOMI, MASANORI ; OGAWA, NORITAKA</creatorcontrib><description>In the present invention, the manufacturing process is simplified, the weight and cost are reduced, and a safe and reliable structure is produced by using a generic metal plate. In a heat exchanger according to the present invention, thin metal plates of a predetermined thickness, which have outer surfaces 4a, 5a that are to be positioned on the side of electronic components 3 - objects of heat exchange -, and which have resin-coated inner surfaces 4b, 5b, are press-worked to a predetermined shape, whereby a first molded body 4 and a second molded body 5 are formed. The two molded bodies are combined so that the inner surfaces 4b, 5b thereof face each other, and the inner surface 4c at the edge portion 4c and the inner surface 5b at the edge portion 5c are thermally fused together by hot press-working. The edge portions 4c, 5c are performed to ultrafine processing and then inserted into a die, and a thermoplastic resin composition is injected into the cavity of the die, whereby a joining member 6 is molded. A space 7 created by the combining has a supply port 10 and a discharge port 11 and serves as a fluid passage for a heat medium 8. A heat exchanger 1 has such a structure, the outer surfaces 4a, 5a are brought into contact with electronic components 3, and heat exchange is performed with the heat medium flowing through the fluid passage.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEATING ; LIGHTING ; MECHANICAL ENGINEERING ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151125&DB=EPODOC&CC=EP&NR=2947412A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20151125&DB=EPODOC&CC=EP&NR=2947412A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NARITOMI, MASANORI</creatorcontrib><creatorcontrib>OGAWA, NORITAKA</creatorcontrib><title>HEAT EXCHANGER AND METHOD FOR MANUFACTURING SAME</title><description>In the present invention, the manufacturing process is simplified, the weight and cost are reduced, and a safe and reliable structure is produced by using a generic metal plate. In a heat exchanger according to the present invention, thin metal plates of a predetermined thickness, which have outer surfaces 4a, 5a that are to be positioned on the side of electronic components 3 - objects of heat exchange -, and which have resin-coated inner surfaces 4b, 5b, are press-worked to a predetermined shape, whereby a first molded body 4 and a second molded body 5 are formed. The two molded bodies are combined so that the inner surfaces 4b, 5b thereof face each other, and the inner surface 4c at the edge portion 4c and the inner surface 5b at the edge portion 5c are thermally fused together by hot press-working. The edge portions 4c, 5c are performed to ultrafine processing and then inserted into a die, and a thermoplastic resin composition is injected into the cavity of the die, whereby a joining member 6 is molded. A space 7 created by the combining has a supply port 10 and a discharge port 11 and serves as a fluid passage for a heat medium 8. A heat exchanger 1 has such a structure, the outer surfaces 4a, 5a are brought into contact with electronic components 3, and heat exchange is performed with the heat medium flowing through the fluid passage.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MECHANICAL ENGINEERING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDwcHUMUXCNcPZw9HN3DVJw9HNR8HUN8fB3UXDzD1LwdfQLdXN0DgkN8vRzVwh29HXlYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgFGlibmJoZGjobGRCgBAMVYJaU</recordid><startdate>20151125</startdate><enddate>20151125</enddate><creator>NARITOMI, MASANORI</creator><creator>OGAWA, NORITAKA</creator><scope>EVB</scope></search><sort><creationdate>20151125</creationdate><title>HEAT EXCHANGER AND METHOD FOR MANUFACTURING SAME</title><author>NARITOMI, MASANORI ; OGAWA, NORITAKA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2947412A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MECHANICAL ENGINEERING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>NARITOMI, MASANORI</creatorcontrib><creatorcontrib>OGAWA, NORITAKA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NARITOMI, MASANORI</au><au>OGAWA, NORITAKA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEAT EXCHANGER AND METHOD FOR MANUFACTURING SAME</title><date>2015-11-25</date><risdate>2015</risdate><abstract>In the present invention, the manufacturing process is simplified, the weight and cost are reduced, and a safe and reliable structure is produced by using a generic metal plate. In a heat exchanger according to the present invention, thin metal plates of a predetermined thickness, which have outer surfaces 4a, 5a that are to be positioned on the side of electronic components 3 - objects of heat exchange -, and which have resin-coated inner surfaces 4b, 5b, are press-worked to a predetermined shape, whereby a first molded body 4 and a second molded body 5 are formed. The two molded bodies are combined so that the inner surfaces 4b, 5b thereof face each other, and the inner surface 4c at the edge portion 4c and the inner surface 5b at the edge portion 5c are thermally fused together by hot press-working. The edge portions 4c, 5c are performed to ultrafine processing and then inserted into a die, and a thermoplastic resin composition is injected into the cavity of the die, whereby a joining member 6 is molded. A space 7 created by the combining has a supply port 10 and a discharge port 11 and serves as a fluid passage for a heat medium 8. A heat exchanger 1 has such a structure, the outer surfaces 4a, 5a are brought into contact with electronic components 3, and heat exchange is performed with the heat medium flowing through the fluid passage.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS BLASTING DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OFGENERAL APPLICATION ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEATING LIGHTING MECHANICAL ENGINEERING SEMICONDUCTOR DEVICES WEAPONS |
title | HEAT EXCHANGER AND METHOD FOR MANUFACTURING SAME |
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