RESIN COMPOSITION, PREPREG, LAMINATE, METAL FOIL-CLAD LAMINATE, AND PRINTED WIRING BOARD

The present invention provides a resin composition including: nanoparticles (A) of alumina and/or boehmite having an average particle size of 1.0 nm to 100 nm; fine particles (B) having an average particle size of 0.20 µm to 100 µm; and a thermosetting resin (C), wherein the nanoparticles (A) have t...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TOMIZAWA, Katsuya, SHIGA, Eisuke, CHIBA, Tomo, NOMIZU, Kentaro, TAKAHASHI, Hiroshi, UEYAMA, Daisuke
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP
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