REDUCED THERMAL TRANSFER TO PELTIER COOLED FETS

A printed circuit board for use with a cooling device configured to cool at least one device is provided. The printed circuit board includes a substrate having a first surface and a second surface opposing the first surface; a ground plane on the first surface of the substrate, and circuitry in a ci...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	BORYSENKO, SERGIY, STRICKLAND, PETER CHARLES, JESSUP, BRADLEY
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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