SYSTEMS AND METHODS FOR PROVIDING WAFER ACCESS IN A WAFER PROCESSING SYSTEM

Systems and methods for providing wafer access in a wafer processing system are disclosed herein. The methods may include docking a first wafer cassette on the wafer processing system and removing a selected wafer from the first wafer cassette with the wafer processing system. The methods further ma...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FEHRMANN, FRANK, HIRSCHFELD, BOTHO, KANEV, STOJAN
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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