SENSOR CHIP AND METHOD FOR STORING SENSOR CHIP
[Problem] The present invention provides: a sensor chip in which occurrence of defects on a metal thin film, such as circular protrusions, can be reduced and a reduction in the assay performance of the sensor chip caused by such defects can be thereby suppressed; and a method of storing a sensor chi...
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creator | TSUKAGOSHI, MASANORI HIKAGE, NAOKI MATSUO, MASATAKA WADA, TAKESHI |
description | [Problem] The present invention provides: a sensor chip in which occurrence of defects on a metal thin film, such as circular protrusions, can be reduced and a reduction in the assay performance of the sensor chip caused by such defects can be thereby suppressed; and a method of storing a sensor chip. [Means for Solution] Provided is a sensor chip comprising: a transparent support; a metal thin film formed on one surface of the transparent support; and a reaction section in which a ligand is immobilized on the other surface of the metal thin film that is not in contact with the transparent support, wherein the sensor chip also comprises a closed space-forming member which forms a closed space such that at least the reaction section is housed in the closed space, and the water content in the closed space is adjusted to satisfy: X/Y < 10 (µg/mm 2 ) (wherein, X represents the water content in the closed space; and Y represents the surface area of the metal thin film in the closed space). |
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[Means for Solution] Provided is a sensor chip comprising: a transparent support; a metal thin film formed on one surface of the transparent support; and a reaction section in which a ligand is immobilized on the other surface of the metal thin film that is not in contact with the transparent support, wherein the sensor chip also comprises a closed space-forming member which forms a closed space such that at least the reaction section is housed in the closed space, and the water content in the closed space is adjusted to satisfy: X/Y < 10 (µg/mm 2 ) (wherein, X represents the water content in the closed space; and Y represents the surface area of the metal thin film in the closed space).</description><language>eng ; fre ; ger</language><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; PHYSICS ; TESTING</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150729&DB=EPODOC&CC=EP&NR=2899532A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,309,781,886,25568,76551</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150729&DB=EPODOC&CC=EP&NR=2899532A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TSUKAGOSHI, MASANORI</creatorcontrib><creatorcontrib>HIKAGE, NAOKI</creatorcontrib><creatorcontrib>MATSUO, MASATAKA</creatorcontrib><creatorcontrib>WADA, TAKESHI</creatorcontrib><title>SENSOR CHIP AND METHOD FOR STORING SENSOR CHIP</title><description>[Problem] The present invention provides: a sensor chip in which occurrence of defects on a metal thin film, such as circular protrusions, can be reduced and a reduction in the assay performance of the sensor chip caused by such defects can be thereby suppressed; and a method of storing a sensor chip. [Means for Solution] Provided is a sensor chip comprising: a transparent support; a metal thin film formed on one surface of the transparent support; and a reaction section in which a ligand is immobilized on the other surface of the metal thin film that is not in contact with the transparent support, wherein the sensor chip also comprises a closed space-forming member which forms a closed space such that at least the reaction section is housed in the closed space, and the water content in the closed space is adjusted to satisfy: X/Y < 10 (µg/mm 2 ) (wherein, X represents the water content in the closed space; and Y represents the surface area of the metal thin film in the closed space).</description><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZNALdvUL9g9ScPbwDFBw9HNR8HUN8fB3UXADigWH-Ad5-rkrICnhYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgFGFpaWpsZGjobGRCgBAIuEJUY</recordid><startdate>20150729</startdate><enddate>20150729</enddate><creator>TSUKAGOSHI, MASANORI</creator><creator>HIKAGE, NAOKI</creator><creator>MATSUO, MASATAKA</creator><creator>WADA, TAKESHI</creator><scope>EVB</scope></search><sort><creationdate>20150729</creationdate><title>SENSOR CHIP AND METHOD FOR STORING SENSOR CHIP</title><author>TSUKAGOSHI, MASANORI ; HIKAGE, NAOKI ; MATSUO, MASATAKA ; WADA, TAKESHI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2899532A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2015</creationdate><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>TSUKAGOSHI, MASANORI</creatorcontrib><creatorcontrib>HIKAGE, NAOKI</creatorcontrib><creatorcontrib>MATSUO, MASATAKA</creatorcontrib><creatorcontrib>WADA, TAKESHI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TSUKAGOSHI, MASANORI</au><au>HIKAGE, NAOKI</au><au>MATSUO, MASATAKA</au><au>WADA, TAKESHI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SENSOR CHIP AND METHOD FOR STORING SENSOR CHIP</title><date>2015-07-29</date><risdate>2015</risdate><abstract>[Problem] The present invention provides: a sensor chip in which occurrence of defects on a metal thin film, such as circular protrusions, can be reduced and a reduction in the assay performance of the sensor chip caused by such defects can be thereby suppressed; and a method of storing a sensor chip. [Means for Solution] Provided is a sensor chip comprising: a transparent support; a metal thin film formed on one surface of the transparent support; and a reaction section in which a ligand is immobilized on the other surface of the metal thin film that is not in contact with the transparent support, wherein the sensor chip also comprises a closed space-forming member which forms a closed space such that at least the reaction section is housed in the closed space, and the water content in the closed space is adjusted to satisfy: X/Y < 10 (µg/mm 2 ) (wherein, X represents the water content in the closed space; and Y represents the surface area of the metal thin film in the closed space).</abstract><oa>free_for_read</oa></addata></record> |
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subjects | INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS TESTING |
title | SENSOR CHIP AND METHOD FOR STORING SENSOR CHIP |
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