INSPECTING A WAFER AND/OR PREDICTING ONE OR MORE CHARACTERISTICS OF A DEVICE BEING FORMED ON A WAFER
Methods for inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer are provided. One method includes acquiring images for multiple die printed on a wafer, each of which is printed by performing a double patterning lithography process on the wafer and whi...
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| creator | CHANG, ELLIS WIDMANN, AMIR ROBINSON, JOHN PARK, ALLEN MARCUCCILLI, GINO |
| description | Methods for inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer are provided. One method includes acquiring images for multiple die printed on a wafer, each of which is printed by performing a double patterning lithography process on the wafer and which include two or more die printed at nominal values of overlay for the double patterning lithography process and one or more die printed at modulated values of the overlay; comparing the images acquired for the multiple die printed at the nominal values to the images acquired for the multiple die printed at the modulated values; and detecting defects in the multiple die printed at the modulated values based on results of the comparing step. |
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| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP2880427A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP2880427A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP2880427A13</originalsourceid><addsrcrecordid>eNqNjMEKwjAQRHPxIOo_7A-IWgV7XZON3UOTsA31WIrGk2ih_j9G1LungZn3Zqou7JpAOrI7AsIJLQmgMysvEIQMfxbvCHJTeyHQFQrqSMJNZN2At1k01LImONCbtl5qMln6Pc7V5NrfxrT45kyBpairZRoeXRqH_pzu6dlRKMpyvSv2uNn-gbwAdlszNA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>INSPECTING A WAFER AND/OR PREDICTING ONE OR MORE CHARACTERISTICS OF A DEVICE BEING FORMED ON A WAFER</title><source>esp@cenet</source><creator>CHANG, ELLIS ; WIDMANN, AMIR ; ROBINSON, JOHN ; PARK, ALLEN ; MARCUCCILLI, GINO</creator><creatorcontrib>CHANG, ELLIS ; WIDMANN, AMIR ; ROBINSON, JOHN ; PARK, ALLEN ; MARCUCCILLI, GINO</creatorcontrib><description>Methods for inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer are provided. One method includes acquiring images for multiple die printed on a wafer, each of which is printed by performing a double patterning lithography process on the wafer and which include two or more die printed at nominal values of overlay for the double patterning lithography process and one or more die printed at modulated values of the overlay; comparing the images acquired for the multiple die printed at the nominal values to the images acquired for the multiple die printed at the modulated values; and detecting defects in the multiple die printed at the modulated values based on results of the comparing step.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES ; MEASURING ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150610&DB=EPODOC&CC=EP&NR=2880427A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150610&DB=EPODOC&CC=EP&NR=2880427A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>CHANG, ELLIS</creatorcontrib><creatorcontrib>WIDMANN, AMIR</creatorcontrib><creatorcontrib>ROBINSON, JOHN</creatorcontrib><creatorcontrib>PARK, ALLEN</creatorcontrib><creatorcontrib>MARCUCCILLI, GINO</creatorcontrib><title>INSPECTING A WAFER AND/OR PREDICTING ONE OR MORE CHARACTERISTICS OF A DEVICE BEING FORMED ON A WAFER</title><description>Methods for inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer are provided. One method includes acquiring images for multiple die printed on a wafer, each of which is printed by performing a double patterning lithography process on the wafer and which include two or more die printed at nominal values of overlay for the double patterning lithography process and one or more die printed at modulated values of the overlay; comparing the images acquired for the multiple die printed at the nominal values to the images acquired for the multiple die printed at the modulated values; and detecting defects in the multiple die printed at the modulated values based on results of the comparing step.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</subject><subject>MEASURING</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjMEKwjAQRHPxIOo_7A-IWgV7XZON3UOTsA31WIrGk2ih_j9G1LungZn3Zqou7JpAOrI7AsIJLQmgMysvEIQMfxbvCHJTeyHQFQrqSMJNZN2At1k01LImONCbtl5qMln6Pc7V5NrfxrT45kyBpairZRoeXRqH_pzu6dlRKMpyvSv2uNn-gbwAdlszNA</recordid><startdate>20150610</startdate><enddate>20150610</enddate><creator>CHANG, ELLIS</creator><creator>WIDMANN, AMIR</creator><creator>ROBINSON, JOHN</creator><creator>PARK, ALLEN</creator><creator>MARCUCCILLI, GINO</creator><scope>EVB</scope></search><sort><creationdate>20150610</creationdate><title>INSPECTING A WAFER AND/OR PREDICTING ONE OR MORE CHARACTERISTICS OF A DEVICE BEING FORMED ON A WAFER</title><author>CHANG, ELLIS ; WIDMANN, AMIR ; ROBINSON, JOHN ; PARK, ALLEN ; MARCUCCILLI, GINO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2880427A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES</topic><topic>MEASURING</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>CHANG, ELLIS</creatorcontrib><creatorcontrib>WIDMANN, AMIR</creatorcontrib><creatorcontrib>ROBINSON, JOHN</creatorcontrib><creatorcontrib>PARK, ALLEN</creatorcontrib><creatorcontrib>MARCUCCILLI, GINO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>CHANG, ELLIS</au><au>WIDMANN, AMIR</au><au>ROBINSON, JOHN</au><au>PARK, ALLEN</au><au>MARCUCCILLI, GINO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>INSPECTING A WAFER AND/OR PREDICTING ONE OR MORE CHARACTERISTICS OF A DEVICE BEING FORMED ON A WAFER</title><date>2015-06-10</date><risdate>2015</risdate><abstract>Methods for inspecting a wafer and/or predicting one or more characteristics of a device being formed on a wafer are provided. One method includes acquiring images for multiple die printed on a wafer, each of which is printed by performing a double patterning lithography process on the wafer and which include two or more die printed at nominal values of overlay for the double patterning lithography process and one or more die printed at modulated values of the overlay; comparing the images acquired for the multiple die printed at the nominal values to the images acquired for the multiple die printed at the modulated values; and detecting defects in the multiple die printed at the modulated values based on results of the comparing step.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | INSPECTING A WAFER AND/OR PREDICTING ONE OR MORE CHARACTERISTICS OF A DEVICE BEING FORMED ON A WAFER |
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