THERMALLY CONDUCTIVE SHEET
A heat conductive sheet is provided in which the frequency of contact between fibrous fillers is high. In the heat conductive sheet, the exposed ends of fibrous fillers do not remain exposed and are embedded into the sheet, and it is unnecessary to apply a load that may interfere with the normal ope...
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| creator | ISHII Takuhiro ARAMAKI Keisuke |
| description | A heat conductive sheet is provided in which the frequency of contact between fibrous fillers is high. In the heat conductive sheet, the exposed ends of fibrous fillers do not remain exposed and are embedded into the sheet, and it is unnecessary to apply a load that may interfere with the normal operation of a heat generating body and a heat dissipator to the heat generating body and the heat dissipator when the heat conductive sheet is disposed therebetween. The heat conductive sheet contains fibrous fillers and a binder resin, and the ratio of the fibrous fillers that are oriented in the direction of the thickness of the heat conductive sheet in all the fibrous fillers is 45 to 95%. |
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In the heat conductive sheet, the exposed ends of fibrous fillers do not remain exposed and are embedded into the sheet, and it is unnecessary to apply a load that may interfere with the normal operation of a heat generating body and a heat dissipator to the heat generating body and the heat dissipator when the heat conductive sheet is disposed therebetween. The heat conductive sheet contains fibrous fillers and a binder resin, and the ratio of the fibrous fillers that are oriented in the direction of the thickness of the heat conductive sheet in all the fibrous fillers is 45 to 95%.</description><language>eng ; fre ; ger</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERAL PROCESSES OF COMPOUNDING ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS ; WORKING-UP</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201202&DB=EPODOC&CC=EP&NR=2871674B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20201202&DB=EPODOC&CC=EP&NR=2871674B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ISHII Takuhiro</creatorcontrib><creatorcontrib>ARAMAKI Keisuke</creatorcontrib><title>THERMALLY CONDUCTIVE SHEET</title><description>A heat conductive sheet is provided in which the frequency of contact between fibrous fillers is high. 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In the heat conductive sheet, the exposed ends of fibrous fillers do not remain exposed and are embedded into the sheet, and it is unnecessary to apply a load that may interfere with the normal operation of a heat generating body and a heat dissipator to the heat generating body and the heat dissipator when the heat conductive sheet is disposed therebetween. The heat conductive sheet contains fibrous fillers and a binder resin, and the ratio of the fibrous fillers that are oriented in the direction of the thickness of the heat conductive sheet in all the fibrous fillers is 45 to 95%.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
| title | THERMALLY CONDUCTIVE SHEET |
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