METHOD FOR FORMING CONDUCTIVE FILM AND SINTERING PROMOTER
In a conductive film forming method using photo sintering, a conductive film having low electric resistance is easily formed. The conductive film forming method is a method in which a conductive film 5 is formed using photo sintering. This method includes the steps of forming a layer 22 made of a si...
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| creator | KAWATO, YUICHI KUDO, TOMIO MAEDA, YUSUKE |
| description | In a conductive film forming method using photo sintering, a conductive film having low electric resistance is easily formed. The conductive film forming method is a method in which a conductive film 5 is formed using photo sintering. This method includes the steps of forming a layer 22 made of a sintering promoter 2 on a substrate, forming a liquid film 3 made of a copper particulate dispersion on the layer 22 of the sintering promoter 2, drying the liquid film 3 to form a copper particulate layer 4, and subjecting the copper particulate layer 4 to photo sintering. The sintering promoter 2 is a compound which removes copper oxide from metallic copper. Thereby, the sintering promoter 2 removes a surface oxide film of copper particulates 31 in photo sintering. |
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The conductive film forming method is a method in which a conductive film 5 is formed using photo sintering. This method includes the steps of forming a layer 22 made of a sintering promoter 2 on a substrate, forming a liquid film 3 made of a copper particulate dispersion on the layer 22 of the sintering promoter 2, drying the liquid film 3 to form a copper particulate layer 4, and subjecting the copper particulate layer 4 to photo sintering. The sintering promoter 2 is a compound which removes copper oxide from metallic copper. 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The conductive film forming method is a method in which a conductive film 5 is formed using photo sintering. This method includes the steps of forming a layer 22 made of a sintering promoter 2 on a substrate, forming a liquid film 3 made of a copper particulate dispersion on the layer 22 of the sintering promoter 2, drying the liquid film 3 to form a copper particulate layer 4, and subjecting the copper particulate layer 4 to photo sintering. The sintering promoter 2 is a compound which removes copper oxide from metallic copper. 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The conductive film forming method is a method in which a conductive film 5 is formed using photo sintering. This method includes the steps of forming a layer 22 made of a sintering promoter 2 on a substrate, forming a liquid film 3 made of a copper particulate dispersion on the layer 22 of the sintering promoter 2, drying the liquid film 3 to form a copper particulate layer 4, and subjecting the copper particulate layer 4 to photo sintering. The sintering promoter 2 is a compound which removes copper oxide from metallic copper. Thereby, the sintering promoter 2 removes a surface oxide film of copper particulates 31 in photo sintering.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CASTING CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS POWDER METALLURGY PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES TRANSPORTING WORKING METALLIC POWDER |
| title | METHOD FOR FORMING CONDUCTIVE FILM AND SINTERING PROMOTER |
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