Shutter system

The present invention relates to an apparatus for treating and/or coating substrate surfaces having a substrate shutter system which allows a better economical utilization of the apparatus as well as a more versatile buildup of multilayer coating structures. The apparatus according to the present in...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser:	Kurapov, Denis
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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Beschreibung
Zusammenfassung:	The present invention relates to an apparatus for treating and/or coating substrate surfaces having a substrate shutter system which allows a better economical utilization of the apparatus as well as a more versatile buildup of multilayer coating structures. The apparatus according to the present invention is characterized by comprising at least one substrate holding system (3) that comprises at least one shutter system comprising at least one movable shutter element (1) to be arranged around of at least a portion of the holder system for shielding at least some of the substrates arranged in the holding system in such a manner that the surface of the shielded substrates cannot be treated during the execution of the one or more surface treatments or at least during a part of the execution of the one or more surface treatments because the movable shutter element interrupts at least partially or avoid completely the surface treatment of the shielded substrates.