Moulding material on the basis of a partially aromatic copolyamide

A moulding composition contains at least 40 wt % of components a) and b). Based on the sum of components a) and b), there are 60-99 wt % of component a) and 40-1 wt % of component b). Component a) is a partially aromatic copolyamide containing, as polymerized monomer units, 30-90 mol % of a combination of hexamethylenediamine and terephthalic acid and 70-10 mol % of a combination of hexamethylenediamine and a linear aliphatic dicarboxylic acid having 8-19 C atoms. Component b) is an olefinic copolymer containing, as polymerized monomer units, i) 35-94.9 wt % of ethene-based monomer units, ii) 5-65 wt % of monomer units based on a 1-alkene having 4-8 C atoms, iii) 0-10 wt % of monomer units based on an olefin different from i) and ii), and iv) 0.1-2.5 wt % of monomer units based on an aliphatically unsaturated dicarboxylic acid anhydride, where the sum of wt % of i), ii), iii) and iv) is 100%.