Semiconductor substrate including a cooling channel and method of forming a semiconductor substrate including a cooling channel

A semiconductor substrate (12) for use in an integrated circuit includes a channel (22) defined on a surface (18) of the substrate (12). The channel (22) includes a first wall (24), a second wall (26), and a third wall (28). The first wall (24) is recessed from the surface (18). The second wall (26)...

Ausführliche Beschreibung

Bibliographische Detailangaben

1. Verfasser:	Bouras, Scott R
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!