Ultrahigh-purity copper bonding wire

Provided is ultrahigh purity copper having a hardness of 40Hv or less, and a purity of 8N or higher (provided that this excludes the gas components of O, C, N, H, S and P). With this ultrahigh purity copper, the respective elements of O, S and P as gas components are 1wtppm or less. Also provided is...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	SHINDO, YUICHIRO, TAKEMOTO, KOUICHI
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ALLOYS APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROLYTIC OR ELECTROPHORETIC PROCESSES FERROUS OR NON-FERROUS ALLOYS METALLURGY PRETREATMENT OF RAW MATERIALS PROCESSES FOR THE ELECTROLYTIC PRODUCTION, RECOVERY ORREFINING OF METALS PRODUCTION AND REFINING OF METALS SEMICONDUCTOR DEVICES TREATMENT OF ALLOYS OR NON-FERROUS METALS
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