RESIN COMPOSITION, PREPREG, RESIN SHEET, AND METAL FOIL-CLAD LAMINATE
The present invention provides a resin composition that not only has high flame retardancy but also has excellent heat resistance, peel strength with copper foil, thermal expansion coefficient, heat resistance property upon moisture absorption, and electrical properties, a prepreg and a single-layer...
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| creator | UENO, YOSHITAKA YAGINUMA, MICHIO FUKASAWA, EMI ITOH, SYOUICHI |
| description | The present invention provides a resin composition that not only has high flame retardancy but also has excellent heat resistance, peel strength with copper foil, thermal expansion coefficient, heat resistance property upon moisture absorption, and electrical properties, a prepreg and a single-layer or laminated sheet using the same, a metal foil-clad laminate using the prepreg, and the like. The resin composition of the present invention is a resin composition having polyphenylene ether (A) having a number average molecular weight of 500 to 5000, a phosphorus-containing cyanate ester compound (B) represented by the following formula (13), a cyclophosphazene compound (C), a halogen-free epoxy resin (D), a cyanate ester compound (E) other than the phosphorus-containing cyanate ester compound (B), an oligomer (F) of styrene and/or substituted styrene, and a filler (G), wherein a content of the phosphorus-containing cyanate ester compound (B) is 1 to 10 parts by mass based on 100 parts by mass of a total of the (A) to (F) components.
wherein m represents an integer of 1 to 3. |
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wherein m represents an integer of 1 to 3.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERAL PROCESSES OF COMPOUNDING LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS PRINTED CIRCUITS THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS WORKING-UP |
| title | RESIN COMPOSITION, PREPREG, RESIN SHEET, AND METAL FOIL-CLAD LAMINATE |
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