METHOD COMPRISING PRODUCING AT LEAST ONE ASSEMBLY PAD ON A SUPPORT AND SELF-ASSEMBLY OF AN INTEGRATED CIRCUIT CHIP ON THE SUPPORT WITH FORMATION OF A FLUOROCARBON MATERIAL SURROUNDING THE PAD AND EXPOSURE OF THE PAD AND OF THE FLUOROCARBON MATERIAL TO ULTRAVIOLET TREATMENT IN THE PRESENCE OF OZONE

A method for producing at least one pad assembly (32, 50) on a support (19, 43) for use in a method for self-assembling at least one element (10) on the support (19, 43), comprises fanning, on the support (19, 43), a layer (28, 48) of at least one fluorinated material around the location (30, 44) of...

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Bibliographische Detailangaben

Hauptverfasser:	DI CIOCCIO, Léa, MERMOZ, Sébastien, SANCHEZ, Loïc
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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