Fluid cooled enclosure for circuit module apparatus and methods of cooling a conduction cooled circuit module

A fluid cooled enclosure ( 101 , 501 ) includes a fluid conduit ( 111 , 401 , 403 , 505 ) that provides a fluid coolant path ( 301 , 301a , 301b , 311 , 311a , 311b , 701 , 705 , 709 ) between sides of a housing ( 105 ). Optionally, the fluid conduit can provide bi-directional fluid coolant paths. I...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	RATLIFF, WILLIAM EDWARD, STRAZNICKY, IVAN
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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