Ethylene-propylene-diene buffer material and sealing material
A buffer material is obtained by foaming a rubber composition containing an ethylene-propylene-diene rubber. In the buffer material, the content ratio of a sulfur atom calculated based on the measurement result of a fluorescent X-ray measurement, based on mass, is 1000 ppm or less, the buffer materi...
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creator | IWASE, TAKAYUKI HIRAI, BUNTA |
description | A buffer material is obtained by foaming a rubber composition containing an ethylene-propylene-diene rubber. In the buffer material, the content ratio of a sulfur atom calculated based on the measurement result of a fluorescent X-ray measurement, based on mass, is 1000 ppm or less, the buffer material has a 50 % compressive load value of 0.1 N/cm 2 or more and 2.0 N/cm 2 or less, and the buffer material has a stress relaxation rate in a compressed state of 50 % after 10 seconds of compression of 60 % or more. |
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In the buffer material, the content ratio of a sulfur atom calculated based on the measurement result of a fluorescent X-ray measurement, based on mass, is 1000 ppm or less, the buffer material has a 50 % compressive load value of 0.1 N/cm 2 or more and 2.0 N/cm 2 or less, and the buffer material has a stress relaxation rate in a compressed state of 50 % after 10 seconds of compression of 60 % or more.</description><language>eng ; fre ; ger</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; GENERAL PROCESSES OF COMPOUNDING ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; POLISHES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; USE OF MATERIALS AS ADHESIVES ; WORKING-UP</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141105&DB=EPODOC&CC=EP&NR=2781542A3$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141105&DB=EPODOC&CC=EP&NR=2781542A3$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>IWASE, TAKAYUKI</creatorcontrib><creatorcontrib>HIRAI, BUNTA</creatorcontrib><title>Ethylene-propylene-diene buffer material and sealing material</title><description>A buffer material is obtained by foaming a rubber composition containing an ethylene-propylene-diene rubber. In the buffer material, the content ratio of a sulfur atom calculated based on the measurement result of a fluorescent X-ray measurement, based on mass, is 1000 ppm or less, the buffer material has a 50 % compressive load value of 0.1 N/cm 2 or more and 2.0 N/cm 2 or less, and the buffer material has a stress relaxation rate in a compressed state of 50 % after 10 seconds of compression of 60 % or more.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DYES</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLB1LcmozEnNS9UtKMovgLBSMoGkQlJpWlpqkUJuYklqUWZijkJiXopCcWpiTmZeOlyQh4E1LTGnOJUXSnMzKLi5hjh76KYW5MenFhckJgNNKol3DTAytzA0NTFyNDYmQgkA6PowEw</recordid><startdate>20141105</startdate><enddate>20141105</enddate><creator>IWASE, TAKAYUKI</creator><creator>HIRAI, BUNTA</creator><scope>EVB</scope></search><sort><creationdate>20141105</creationdate><title>Ethylene-propylene-diene buffer material and sealing material</title><author>IWASE, TAKAYUKI ; HIRAI, BUNTA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2781542A33</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2014</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DYES</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>IWASE, TAKAYUKI</creatorcontrib><creatorcontrib>HIRAI, BUNTA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>IWASE, TAKAYUKI</au><au>HIRAI, BUNTA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Ethylene-propylene-diene buffer material and sealing material</title><date>2014-11-05</date><risdate>2014</risdate><abstract>A buffer material is obtained by foaming a rubber composition containing an ethylene-propylene-diene rubber. In the buffer material, the content ratio of a sulfur atom calculated based on the measurement result of a fluorescent X-ray measurement, based on mass, is 1000 ppm or less, the buffer material has a 50 % compressive load value of 0.1 N/cm 2 or more and 2.0 N/cm 2 or less, and the buffer material has a stress relaxation rate in a compressed state of 50 % after 10 seconds of compression of 60 % or more.</abstract><oa>free_for_read</oa></addata></record> |
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language | eng ; fre ; ger |
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subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES GENERAL PROCESSES OF COMPOUNDING METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF MATERIALS AS ADHESIVES WORKING-UP |
title | Ethylene-propylene-diene buffer material and sealing material |
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