LIGHT-EMITTING DIODE PACKAGE

According to the present invention, a light-emitting diode package comprises: a substrate for growth; a passivation layer formed on a surface of one side of the substrate for growth; and a package substrate having a main body portion and a wall portion, wherein the wall portion is formed on the main...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	KIM, CHANG HOON, PARK, JUN YONG, JANG, BO RAM I, JUNG, HEE CHEUL, SUH, DAE WOONG, LEE, KYU HO
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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