METHODS OF FORMING THROUGH-SUBSTRATE VIAS

A method of forming through-substrate vias includes separately electrodepositing copper and at least one element other than copper to fill remaining volume of through-substrate via openings formed within a substrate. The electrodeposited copper and the at least one other element are annealed to form...

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Bibliographische Detailangaben
1. Verfasser:	ENGLAND, Luke, G
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	APPARATUS THEREFOR BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:	A method of forming through-substrate vias includes separately electrodepositing copper and at least one element other than copper to fill remaining volume of through-substrate via openings formed within a substrate. The electrodeposited copper and the at least one other element are annealed to form an alloy of the copper and the at least one other element which is used in forming conductive through-substrate via structures that include the alloy.