SOLDER MASK WITH ANCHOR STRUCTURES

Various substrates or circuit boards for receiving a semiconductor chip and methods of processing the same are disclosed. In one aspect, a method of manufacturing is provided that includes forming a first opening in a solder mask positioned on a side of a substrate. The first opening does not extend...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TOPACIO, Roden, R, HSIEH, Yu-Ling, KW LEUNG, Andrew, LOW, Yip, Seng
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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