Substrate lamination method

Substrate lamination method

A method for laminating substrates may include disposing a pressure-sensitive adhesive layer (103) between a substantially planar surface of a first substrate (101) and a substantially planar surface of a second substrate (102), disposing the first substrate, the pressure-sensitive adhesive layer, a...

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Hauptverfasser: NEMETH, PAUL R, MARZEN, VINCENT P, BARNIDGE, TRACY J, SAMPICA, JAMES D
Format: Patent
Sprache:eng ; fre ; ger
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BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
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creator NEMETH, PAUL R
MARZEN, VINCENT P
BARNIDGE, TRACY J
SAMPICA, JAMES D
description A method for laminating substrates may include disposing a pressure-sensitive adhesive layer (103) between a substantially planar surface of a first substrate (101) and a substantially planar surface of a second substrate (102), disposing the first substrate, the pressure-sensitive adhesive layer, and the second substrate within a vacuum chamber (110), evacuating the vacuum chamber, and applying a pressure to at least one of the first substrate and the second substrate.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP2749412A1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP2749412A1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP2749412A13</originalsourceid><addsrcrecordid>eNrjZJAOLk0qLilKLElVyEnMzcxLLMnMz1PITS3JyE_hYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgFG5iaWJoZGjobGRCgBAFFvI04</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>Substrate lamination method</title><source>esp@cenet</source><creator>NEMETH, PAUL R ; MARZEN, VINCENT P ; BARNIDGE, TRACY J ; SAMPICA, JAMES D</creator><creatorcontrib>NEMETH, PAUL R ; MARZEN, VINCENT P ; BARNIDGE, TRACY J ; SAMPICA, JAMES D</creatorcontrib><description>A method for laminating substrates may include disposing a pressure-sensitive adhesive layer (103) between a substantially planar surface of a first substrate (101) and a substantially planar surface of a second substrate (102), disposing the first substrate, the pressure-sensitive adhesive layer, and the second substrate within a vacuum chamber (110), evacuating the vacuum chamber, and applying a pressure to at least one of the first substrate and the second substrate.</description><language>eng ; fre ; ger</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; TRANSPORTING</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140702&amp;DB=EPODOC&amp;CC=EP&amp;NR=2749412A1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140702&amp;DB=EPODOC&amp;CC=EP&amp;NR=2749412A1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NEMETH, PAUL R</creatorcontrib><creatorcontrib>MARZEN, VINCENT P</creatorcontrib><creatorcontrib>BARNIDGE, TRACY J</creatorcontrib><creatorcontrib>SAMPICA, JAMES D</creatorcontrib><title>Substrate lamination method</title><description>A method for laminating substrates may include disposing a pressure-sensitive adhesive layer (103) between a substantially planar surface of a first substrate (101) and a substantially planar surface of a second substrate (102), disposing the first substrate, the pressure-sensitive adhesive layer, and the second substrate within a vacuum chamber (110), evacuating the vacuum chamber, and applying a pressure to at least one of the first substrate and the second substrate.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZJAOLk0qLilKLElVyEnMzcxLLMnMz1PITS3JyE_hYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgFG5iaWJoZGjobGRCgBAFFvI04</recordid><startdate>20140702</startdate><enddate>20140702</enddate><creator>NEMETH, PAUL R</creator><creator>MARZEN, VINCENT P</creator><creator>BARNIDGE, TRACY J</creator><creator>SAMPICA, JAMES D</creator><scope>EVB</scope></search><sort><creationdate>20140702</creationdate><title>Substrate lamination method</title><author>NEMETH, PAUL R ; MARZEN, VINCENT P ; BARNIDGE, TRACY J ; SAMPICA, JAMES D</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2749412A13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>NEMETH, PAUL R</creatorcontrib><creatorcontrib>MARZEN, VINCENT P</creatorcontrib><creatorcontrib>BARNIDGE, TRACY J</creatorcontrib><creatorcontrib>SAMPICA, JAMES D</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NEMETH, PAUL R</au><au>MARZEN, VINCENT P</au><au>BARNIDGE, TRACY J</au><au>SAMPICA, JAMES D</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>Substrate lamination method</title><date>2014-07-02</date><risdate>2014</risdate><abstract>A method for laminating substrates may include disposing a pressure-sensitive adhesive layer (103) between a substantially planar surface of a first substrate (101) and a substantially planar surface of a second substrate (102), disposing the first substrate, the pressure-sensitive adhesive layer, and the second substrate within a vacuum chamber (110), evacuating the vacuum chamber, and applying a pressure to at least one of the first substrate and the second substrate.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
PERFORMING OPERATIONS
SEMICONDUCTOR DEVICES
TRANSPORTING
title Substrate lamination method
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-29T09%3A31%3A35IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=NEMETH,%20PAUL%20R&rft.date=2014-07-02&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP2749412A1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true