Substrate lamination method

A method for laminating substrates may include disposing a pressure-sensitive adhesive layer (103) between a substantially planar surface of a first substrate (101) and a substantially planar surface of a second substrate (102), disposing the first substrate, the pressure-sensitive adhesive layer, a...

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Bibliographische Detailangaben
Hauptverfasser:	NEMETH, PAUL R, MARZEN, VINCENT P, BARNIDGE, TRACY J, SAMPICA, JAMES D
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM PERFORMING OPERATIONS SEMICONDUCTOR DEVICES TRANSPORTING
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Beschreibung
Zusammenfassung:	A method for laminating substrates may include disposing a pressure-sensitive adhesive layer (103) between a substantially planar surface of a first substrate (101) and a substantially planar surface of a second substrate (102), disposing the first substrate, the pressure-sensitive adhesive layer, and the second substrate within a vacuum chamber (110), evacuating the vacuum chamber, and applying a pressure to at least one of the first substrate and the second substrate.