Semiconductor device and method of manufacturing the same

A semiconductor device having a substrate including a plurality of external terminals on a rear surface and a plurality of bonding terminals electrically connected to the plurality of external terminals on a front surface, a semiconductor chip mounted on the front surface of the substrate, a surface...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: SATO, HIDENARI, OOIDA, MITSURU, TOMONAGA, YOSHIYUKI, WATANABE, KATSUMI
Format: Patent
Sprache:eng ; fre ; ger
Schlagworte:
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