METHOD OF MAKING DELAMINATION RESISTANT ASSEMBLIES

The present application is directed to a method of reducing delamination in an assembly. The method comprises providing an assembly and limiting visible light exposure to parts of the assembly to maintain a peel force of 20 grams/inch or greater where the light is limited. The assembly comprises an...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	WEIGEL, MARK, D, BERNIARD, TRACIE, J, RUFF, ANDREW, T
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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