PHOTOSENSITIVE RESIN COMPOSITION
There is provided provide a photosensitive resin composition which can markedly improve transparency, heat resistance, heat discoloration resistance, solvent resistance, and patterning properties. A photosensitive resin composition comprising: a polymer (A) in which a content of a unit structure con...
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| creator | YUKAWA, SHOJIRO |
| description | There is provided provide a photosensitive resin composition which can markedly improve transparency, heat resistance, heat discoloration resistance, solvent resistance, and patterning properties. A photosensitive resin composition comprising: a polymer (A) in which a content of a unit structure containing a boronic acid group, a unit structure containing a boronic acid ester group, or a combination of these unit structures is 20 mol% to 100 mol% of a total molar number of unit structures constituting the polymer; and a photosensitizer (B). The polymer (A) preferably has a weight average molecular weight of 1,000 to 50,000. A cured film obtained from the photosensitive resin composition. A microlens prepared from the photosensitive resin composition. |
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A photosensitive resin composition comprising: a polymer (A) in which a content of a unit structure containing a boronic acid group, a unit structure containing a boronic acid ester group, or a combination of these unit structures is 20 mol% to 100 mol% of a total molar number of unit structures constituting the polymer; and a photosensitizer (B). The polymer (A) preferably has a weight average molecular weight of 1,000 to 50,000. A cured film obtained from the photosensitive resin composition. A microlens prepared from the photosensitive resin composition.</description><language>eng ; fre ; ger</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CHEMISTRY ; CINEMATOGRAPHY ; COMPOSITIONS BASED THEREON ; ELECTROGRAPHY ; HOLOGRAPHY ; MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS ; MATERIALS THEREFOR ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; ORIGINALS THEREFOR ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141224&DB=EPODOC&CC=EP&NR=2711774A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141224&DB=EPODOC&CC=EP&NR=2711774A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>YUKAWA, SHOJIRO</creatorcontrib><title>PHOTOSENSITIVE RESIN COMPOSITION</title><description>There is provided provide a photosensitive resin composition which can markedly improve transparency, heat resistance, heat discoloration resistance, solvent resistance, and patterning properties. A photosensitive resin composition comprising: a polymer (A) in which a content of a unit structure containing a boronic acid group, a unit structure containing a boronic acid ester group, or a combination of these unit structures is 20 mol% to 100 mol% of a total molar number of unit structures constituting the polymer; and a photosensitizer (B). The polymer (A) preferably has a weight average molecular weight of 1,000 to 50,000. A cured film obtained from the photosensitive resin composition. A microlens prepared from the photosensitive resin composition.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CHEMISTRY</subject><subject>CINEMATOGRAPHY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</subject><subject>MATERIALS THEREFOR</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>ORIGINALS THEREFOR</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFAI8PAP8Q929Qv2DPEMc1UIcg329FNw9vcN8AeJ-PvxMLCmJeYUp_JCaW4GBTfXEGcP3dSC_PjU4oLE5NS81JJ41wAjc0NDc3MTRxNjIpQAAOjpIgg</recordid><startdate>20141224</startdate><enddate>20141224</enddate><creator>YUKAWA, SHOJIRO</creator><scope>EVB</scope></search><sort><creationdate>20141224</creationdate><title>PHOTOSENSITIVE RESIN COMPOSITION</title><author>YUKAWA, SHOJIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2711774A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2014</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CHEMISTRY</topic><topic>CINEMATOGRAPHY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS</topic><topic>MATERIALS THEREFOR</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>ORIGINALS THEREFOR</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>YUKAWA, SHOJIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>YUKAWA, SHOJIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PHOTOSENSITIVE RESIN COMPOSITION</title><date>2014-12-24</date><risdate>2014</risdate><abstract>There is provided provide a photosensitive resin composition which can markedly improve transparency, heat resistance, heat discoloration resistance, solvent resistance, and patterning properties. A photosensitive resin composition comprising: a polymer (A) in which a content of a unit structure containing a boronic acid group, a unit structure containing a boronic acid ester group, or a combination of these unit structures is 20 mol% to 100 mol% of a total molar number of unit structures constituting the polymer; and a photosensitizer (B). The polymer (A) preferably has a weight average molecular weight of 1,000 to 50,000. A cured film obtained from the photosensitive resin composition. A microlens prepared from the photosensitive resin composition.</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CHEMISTRY CINEMATOGRAPHY COMPOSITIONS BASED THEREON ELECTROGRAPHY HOLOGRAPHY MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVINGCARBON-TO-CARBON UNSATURATED BONDS MATERIALS THEREFOR METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS THEIR PREPARATION OR CHEMICAL WORKING-UP |
| title | PHOTOSENSITIVE RESIN COMPOSITION |
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