RESIN MOLDED PRODUCT AND METHOD FOR PRODUCING SAME
The present invention provides a resin molded product which can reduce the external force that is applied to a first element from each electroconductive member due to a pressure of a resin at the time of molding, when each of the electroconductive members and the first element are insert-molded with...
Gespeichert in:
Hauptverfasser: | , |
---|---|
Format: | Patent |
Sprache: | eng ; fre ; ger |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!