DISTRIBUTED BUILDING BLOCKS OF R-C CLAMPING CIRCUITRY IN SEMICONDUCTOR DIE CORE AREA
A semiconductor die includes resistor-capacitor (RC) clamping circuitry for electrostatic discharge (ESD) protection of the semiconductor die. The RC clamping circuitry includes building blocks distributed in the pad ring and in the core area of the semiconductor die. The building blocks include at...
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| creator | SIANSURI, Evan DUNDIGAL, Sreeker, R JALILIZEINALI, Reza WORLEY, Eugene R |
| description | A semiconductor die includes resistor-capacitor (RC) clamping circuitry for electrostatic discharge (ESD) protection of the semiconductor die. The RC clamping circuitry includes building blocks distributed in the pad ring and in the core area of the semiconductor die. The building blocks include at least one capacitor block in the core area. The RC clamping circuitry also includes chip level conductive layer connections between each of the distributed building blocks. |
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The RC clamping circuitry includes building blocks distributed in the pad ring and in the core area of the semiconductor die. The building blocks include at least one capacitor block in the core area. 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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | DISTRIBUTED BUILDING BLOCKS OF R-C CLAMPING CIRCUITRY IN SEMICONDUCTOR DIE CORE AREA |
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