Liquid cooled electronics assembly suitable to use electrically conductive coolant

A liquid cooled power electronics assembly (10) configured to use electrically conductive coolant (16) to cool power electronic devices that uses dielectric plates sealed with a metallic seal around the perimeter of the dielectric plates to form a device assembly (10), and then forms another metalli...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	Gerbsch, Erich W, Brandenburg, Scott D, Parker, Richard D, Eesley, Gary L, Berlin, Carl W
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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