Method for forming die assembly with heat spreader

A first major surface of a semiconductor die (204) is attached onto a package substrate (202). A heat spreader (212) is attached to a second major surface of the semiconductor die. The second major surface is opposite the first major surface, and the semiconductor die, package substrate, and heat sp...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	DAVES, GLENN G, HIGGINS, III, LEO M, CARPENTER, BURTON J
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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