LASER MICRO/NANO PROCESSING SYSTEM AND METHOD
A laser micro/nano fabrication system (400) for processing a metal ion solution is described. The system (400) includes a laser light source (1, 2) providing a first laser beam having a first wavelength and a second laser beam having a second wavelength being different from the first wavelength. The...
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| creator | DONG, Xianzi ZHAO, Zhensheng CHEN, Shu CAO, Hongzhong DUAN, Xuanming |
| description | A laser micro/nano fabrication system (400) for processing a metal ion solution is described. The system (400) includes a laser light source (1, 2) providing a first laser beam having a first wavelength and a second laser beam having a second wavelength being different from the first wavelength. The first wavelength is capable of inducing two-photon absorption effects in the metal ion solution to reduce the metal ions to metal nanoparticles. The first laser beam has a pulse width in the range of nanosecond to femtosecond and the second laser beam is a continuous wave laser beam being capable of inducing an optical tweezer effect on the metal nanoparticles. The system (400) also includes an optical focusing assembly (18, 19, 20) for focusing the first laser beam and the second laser beam to the same focal point, and a computer controlled micromovement stage (21). |
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The system (400) includes a laser light source (1, 2) providing a first laser beam having a first wavelength and a second laser beam having a second wavelength being different from the first wavelength. The first wavelength is capable of inducing two-photon absorption effects in the metal ion solution to reduce the metal ions to metal nanoparticles. The first laser beam has a pulse width in the range of nanosecond to femtosecond and the second laser beam is a continuous wave laser beam being capable of inducing an optical tweezer effect on the metal nanoparticles. The system (400) also includes an optical focusing assembly (18, 19, 20) for focusing the first laser beam and the second laser beam to the same focal point, and a computer controlled micromovement stage (21).</description><language>eng ; fre ; ger</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; BASIC ELECTRIC ELEMENTS ; CINEMATOGRAPHY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; ELECTROGRAPHY ; HOLOGRAPHY ; MACHINE TOOLS ; MATERIALS THEREFOR ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; MICROSTRUCTURAL TECHNOLOGY ; ORIGINALS THEREFOR ; PERFORMING OPERATIONS ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2019</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191211&DB=EPODOC&CC=EP&NR=2620249B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20191211&DB=EPODOC&CC=EP&NR=2620249B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>DONG, Xianzi</creatorcontrib><creatorcontrib>ZHAO, Zhensheng</creatorcontrib><creatorcontrib>CHEN, Shu</creatorcontrib><creatorcontrib>CAO, Hongzhong</creatorcontrib><creatorcontrib>DUAN, Xuanming</creatorcontrib><title>LASER MICRO/NANO PROCESSING SYSTEM AND METHOD</title><description>A laser micro/nano fabrication system (400) for processing a metal ion solution is described. The system (400) includes a laser light source (1, 2) providing a first laser beam having a first wavelength and a second laser beam having a second wavelength being different from the first wavelength. The first wavelength is capable of inducing two-photon absorption effects in the metal ion solution to reduce the metal ions to metal nanoparticles. The first laser beam has a pulse width in the range of nanosecond to femtosecond and the second laser beam is a continuous wave laser beam being capable of inducing an optical tweezer effect on the metal nanoparticles. The system (400) also includes an optical focusing assembly (18, 19, 20) for focusing the first laser beam and the second laser beam to the same focal point, and a computer controlled micromovement stage (21).</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CINEMATOGRAPHY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>ELECTROGRAPHY</subject><subject>HOLOGRAPHY</subject><subject>MACHINE TOOLS</subject><subject>MATERIALS THEREFOR</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>MICROSTRUCTURAL TECHNOLOGY</subject><subject>ORIGINALS THEREFOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2019</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZND1cQx2DVLw9XQO8tf3c_TzVwgI8nd2DQ729HNXCI4MDnH1VXD0c1HwdQ3x8HfhYWBNS8wpTuWF0twMCm6uIc4euqkF-fGpxQWJyal5qSXxrgFGZkYGRiaWTobGRCgBAHglJRI</recordid><startdate>20191211</startdate><enddate>20191211</enddate><creator>DONG, Xianzi</creator><creator>ZHAO, Zhensheng</creator><creator>CHEN, Shu</creator><creator>CAO, Hongzhong</creator><creator>DUAN, Xuanming</creator><scope>EVB</scope></search><sort><creationdate>20191211</creationdate><title>LASER MICRO/NANO PROCESSING SYSTEM AND METHOD</title><author>DONG, Xianzi ; ZHAO, Zhensheng ; CHEN, Shu ; CAO, Hongzhong ; DUAN, Xuanming</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2620249B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2019</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CINEMATOGRAPHY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>ELECTROGRAPHY</topic><topic>HOLOGRAPHY</topic><topic>MACHINE TOOLS</topic><topic>MATERIALS THEREFOR</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>MICROSTRUCTURAL TECHNOLOGY</topic><topic>ORIGINALS THEREFOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>DONG, Xianzi</creatorcontrib><creatorcontrib>ZHAO, Zhensheng</creatorcontrib><creatorcontrib>CHEN, Shu</creatorcontrib><creatorcontrib>CAO, Hongzhong</creatorcontrib><creatorcontrib>DUAN, Xuanming</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>DONG, Xianzi</au><au>ZHAO, Zhensheng</au><au>CHEN, Shu</au><au>CAO, Hongzhong</au><au>DUAN, Xuanming</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>LASER MICRO/NANO PROCESSING SYSTEM AND METHOD</title><date>2019-12-11</date><risdate>2019</risdate><abstract>A laser micro/nano fabrication system (400) for processing a metal ion solution is described. The system (400) includes a laser light source (1, 2) providing a first laser beam having a first wavelength and a second laser beam having a second wavelength being different from the first wavelength. The first wavelength is capable of inducing two-photon absorption effects in the metal ion solution to reduce the metal ions to metal nanoparticles. The first laser beam has a pulse width in the range of nanosecond to femtosecond and the second laser beam is a continuous wave laser beam being capable of inducing an optical tweezer effect on the metal nanoparticles. The system (400) also includes an optical focusing assembly (18, 19, 20) for focusing the first laser beam and the second laser beam to the same focal point, and a computer controlled micromovement stage (21).</abstract><oa>free_for_read</oa></addata></record> |
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| language | eng ; fre ; ger |
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| subjects | APPARATUS SPECIALLY ADAPTED THEREFOR BASIC ELECTRIC ELEMENTS CINEMATOGRAPHY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROGRAPHY HOLOGRAPHY MACHINE TOOLS MATERIALS THEREFOR METAL-WORKING NOT OTHERWISE PROVIDED FOR MICROSTRUCTURAL TECHNOLOGY ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | LASER MICRO/NANO PROCESSING SYSTEM AND METHOD |
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