PRESSURE-SENSITIVE ADHESIVE COMPOUND, PRESSURE-SENSITIVE ADHESIVE TAPE, AND WAFER TREATMENT METHOD

The present invention aims to provide an adhesive composition which has high initial adhesion and can strongly fix an adherend, while can be peeled off easily by light irradiation even after undergoing a high-temperature process at 200°C or higher. The present invention also aims to provide an adhes...

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Hauptverfasser:	ASAO Takahiro, SUMII Yuichi, FUKUOKA Masateru, SUGITA Daihei, TONEGAWA Toru, NOMURA Shigeru
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES
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creator	ASAO Takahiro SUMII Yuichi FUKUOKA Masateru SUGITA Daihei TONEGAWA Toru NOMURA Shigeru
description	The present invention aims to provide an adhesive composition which has high initial adhesion and can strongly fix an adherend, while can be peeled off easily by light irradiation even after undergoing a high-temperature process at 200°C or higher. The present invention also aims to provide an adhesive tape produced from the adhesive composition, and wafer treatment method using the adhesive composition. The present invention provides an adhesive composition including an adhesive component, a photoinitiator, and a silicone compound containing a functional group that is crosslinkable with the adhesive component.
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP2617793B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP2617793B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP2617793B13</originalsourceid><addsrcrecordid>eNrjZEgKCHINDg4NctUNdvUL9gzxDHNVcHTxcA0GMZz9fQP8Q_1cdBTwqQpxDHDVUXD0c1EId3RzDVIICXJ1DPF19QtR8HUN8fB34WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BRmaG5uaWxk6GxkQoAQDPRTQP</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>PRESSURE-SENSITIVE ADHESIVE COMPOUND, PRESSURE-SENSITIVE ADHESIVE TAPE, AND WAFER TREATMENT METHOD</title><source>esp@cenet</source><creator>ASAO Takahiro ; SUMII Yuichi ; FUKUOKA Masateru ; SUGITA Daihei ; TONEGAWA Toru ; NOMURA Shigeru</creator><creatorcontrib>ASAO Takahiro ; SUMII Yuichi ; FUKUOKA Masateru ; SUGITA Daihei ; TONEGAWA Toru ; NOMURA Shigeru</creatorcontrib><description>The present invention aims to provide an adhesive composition which has high initial adhesion and can strongly fix an adherend, while can be peeled off easily by light irradiation even after undergoing a high-temperature process at 200°C or higher. The present invention also aims to provide an adhesive tape produced from the adhesive composition, and wafer treatment method using the adhesive composition. The present invention provides an adhesive composition including an adhesive component, a photoinitiator, and a silicone compound containing a functional group that is crosslinkable with the adhesive component.</description><language>eng ; fre ; ger</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ; DYES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LAYERED PRODUCTS ; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM ; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; ORGANIC MACROMOLECULAR COMPOUNDS ; PAINTS ; PERFORMING OPERATIONS ; POLISHES ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200805&DB=EPODOC&CC=EP&NR=2617793B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200805&DB=EPODOC&CC=EP&NR=2617793B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ASAO Takahiro</creatorcontrib><creatorcontrib>SUMII Yuichi</creatorcontrib><creatorcontrib>FUKUOKA Masateru</creatorcontrib><creatorcontrib>SUGITA Daihei</creatorcontrib><creatorcontrib>TONEGAWA Toru</creatorcontrib><creatorcontrib>NOMURA Shigeru</creatorcontrib><title>PRESSURE-SENSITIVE ADHESIVE COMPOUND, PRESSURE-SENSITIVE ADHESIVE TAPE, AND WAFER TREATMENT METHOD</title><description>The present invention aims to provide an adhesive composition which has high initial adhesion and can strongly fix an adherend, while can be peeled off easily by light irradiation even after undergoing a high-temperature process at 200°C or higher. The present invention also aims to provide an adhesive tape produced from the adhesive composition, and wafer treatment method using the adhesive composition. The present invention provides an adhesive composition including an adhesive component, a photoinitiator, and a silicone compound containing a functional group that is crosslinkable with the adhesive component.</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</subject><subject>DYES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LAYERED PRODUCTS</subject><subject>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</subject><subject>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PAINTS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHES</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZEgKCHINDg4NctUNdvUL9gzxDHNVcHTxcA0GMZz9fQP8Q_1cdBTwqQpxDHDVUXD0c1EId3RzDVIICXJ1DPF19QtR8HUN8fB34WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BRmaG5uaWxk6GxkQoAQDPRTQP</recordid><startdate>20200805</startdate><enddate>20200805</enddate><creator>ASAO Takahiro</creator><creator>SUMII Yuichi</creator><creator>FUKUOKA Masateru</creator><creator>SUGITA Daihei</creator><creator>TONEGAWA Toru</creator><creator>NOMURA Shigeru</creator><scope>EVB</scope></search><sort><creationdate>20200805</creationdate><title>PRESSURE-SENSITIVE ADHESIVE COMPOUND, PRESSURE-SENSITIVE ADHESIVE TAPE, AND WAFER TREATMENT METHOD</title><author>ASAO Takahiro ; SUMII Yuichi ; FUKUOKA Masateru ; SUGITA Daihei ; TONEGAWA Toru ; NOMURA Shigeru</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2617793B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2020</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>COMPOSITIONS OF MACROMOLECULAR COMPOUNDS</topic><topic>DYES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LAYERED PRODUCTS</topic><topic>LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM</topic><topic>MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PAINTS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHES</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>ASAO Takahiro</creatorcontrib><creatorcontrib>SUMII Yuichi</creatorcontrib><creatorcontrib>FUKUOKA Masateru</creatorcontrib><creatorcontrib>SUGITA Daihei</creatorcontrib><creatorcontrib>TONEGAWA Toru</creatorcontrib><creatorcontrib>NOMURA Shigeru</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ASAO Takahiro</au><au>SUMII Yuichi</au><au>FUKUOKA Masateru</au><au>SUGITA Daihei</au><au>TONEGAWA Toru</au><au>NOMURA Shigeru</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PRESSURE-SENSITIVE ADHESIVE COMPOUND, PRESSURE-SENSITIVE ADHESIVE TAPE, AND WAFER TREATMENT METHOD</title><date>2020-08-05</date><risdate>2020</risdate><abstract>The present invention aims to provide an adhesive composition which has high initial adhesion and can strongly fix an adherend, while can be peeled off easily by light irradiation even after undergoing a high-temperature process at 200°C or higher. The present invention also aims to provide an adhesive tape produced from the adhesive composition, and wafer treatment method using the adhesive composition. The present invention provides an adhesive composition including an adhesive component, a photoinitiator, and a silicone compound containing a functional group that is crosslinkable with the adhesive component.</abstract><oa>free_for_read</oa></addata></record>
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language	eng ; fre ; ger
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subjects	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS DYES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PERFORMING OPERATIONS POLISHES SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES
title	PRESSURE-SENSITIVE ADHESIVE COMPOUND, PRESSURE-SENSITIVE ADHESIVE TAPE, AND WAFER TREATMENT METHOD
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-28T20%3A21%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ASAO%20Takahiro&rft.date=2020-08-05&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP2617793B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true