METHOD OF MANUFACTURING COPPER POWDER FOR CONDUCTIVE PASTE
There are provided a copper powder for conductive paste, which comprises monodisperse and spherical fine copper particles having a sharp particle size distribution and containing no coarse particles and which can form a thinner electrode film while avoiding a bad influence on electric characteristic...
Gespeichert in:
| Hauptverfasser: | , , , |
|---|---|
| Format: | Patent |
| Sprache: | eng ; fre ; ger |
| Schlagworte: | |
| Online-Zugang: | Volltext bestellen |
| Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
| container_end_page | |
|---|---|
| container_issue | |
| container_start_page | |
| container_title | |
| container_volume | |
| creator | KANESHIRO, Yuki SUENAGA, Shinichi FUJITA, Hidefumi KISHIDA, Minoru |
| description | There are provided a copper powder for conductive paste, which comprises monodisperse and spherical fine copper particles having a sharp particle size distribution and containing no coarse particles and which can form a thinner electrode film while avoiding a bad influence on electric characteristics thereof, and a method for stably producing such a copper powder for conductive paste. After copper is complexed by adding a complexing agent to an aqueous solution containing copper while blowing air into the solution, the blowing of air is stopped, and then, a reducing agent is added to the solution to deposit copper particles by reduction. |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP2614904B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP2614904B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP2614904B13</originalsourceid><addsrcrecordid>eNrjZLDydQ3x8HdR8HdT8HX0C3VzdA4JDfL0c1dw9g8IcA1SCPAPdwFSbv5BQBE_l1DnEM8wV4UAx-AQVx4G1rTEnOJUXijNzaDg5hri7KGbWpAfn1pckJicmpdaEu8aYGRmaGJpYOJkaEyEEgBwmSi7</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD OF MANUFACTURING COPPER POWDER FOR CONDUCTIVE PASTE</title><source>esp@cenet</source><creator>KANESHIRO, Yuki ; SUENAGA, Shinichi ; FUJITA, Hidefumi ; KISHIDA, Minoru</creator><creatorcontrib>KANESHIRO, Yuki ; SUENAGA, Shinichi ; FUJITA, Hidefumi ; KISHIDA, Minoru</creatorcontrib><description>There are provided a copper powder for conductive paste, which comprises monodisperse and spherical fine copper particles having a sharp particle size distribution and containing no coarse particles and which can form a thinner electrode film while avoiding a bad influence on electric characteristics thereof, and a method for stably producing such a copper powder for conductive paste. After copper is complexed by adding a complexing agent to an aqueous solution containing copper while blowing air into the solution, the blowing of air is stopped, and then, a reducing agent is added to the solution to deposit copper particles by reduction.</description><language>eng ; fre ; ger</language><subject>ALLOYS ; BASIC ELECTRIC ELEMENTS ; CABLES ; CASTING ; CHEMISTRY ; CONDUCTORS ; ELECTRICITY ; FERROUS OR NON-FERROUS ALLOYS ; INSULATORS ; MAKING METALLIC POWDER ; MANUFACTURE OF ARTICLES FROM METALLIC POWDER ; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES ; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES ; METALLURGY ; NANOTECHNOLOGY ; PERFORMING OPERATIONS ; POWDER METALLURGY ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES ; TRANSPORTING ; TREATMENT OF ALLOYS OR NON-FERROUS METALS ; WORKING METALLIC POWDER</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200422&DB=EPODOC&CC=EP&NR=2614904B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200422&DB=EPODOC&CC=EP&NR=2614904B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KANESHIRO, Yuki</creatorcontrib><creatorcontrib>SUENAGA, Shinichi</creatorcontrib><creatorcontrib>FUJITA, Hidefumi</creatorcontrib><creatorcontrib>KISHIDA, Minoru</creatorcontrib><title>METHOD OF MANUFACTURING COPPER POWDER FOR CONDUCTIVE PASTE</title><description>There are provided a copper powder for conductive paste, which comprises monodisperse and spherical fine copper particles having a sharp particle size distribution and containing no coarse particles and which can form a thinner electrode film while avoiding a bad influence on electric characteristics thereof, and a method for stably producing such a copper powder for conductive paste. After copper is complexed by adding a complexing agent to an aqueous solution containing copper while blowing air into the solution, the blowing of air is stopped, and then, a reducing agent is added to the solution to deposit copper particles by reduction.</description><subject>ALLOYS</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASTING</subject><subject>CHEMISTRY</subject><subject>CONDUCTORS</subject><subject>ELECTRICITY</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>INSULATORS</subject><subject>MAKING METALLIC POWDER</subject><subject>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</subject><subject>MANUFACTURE OR TREATMENT OF NANOSTRUCTURES</subject><subject>MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES</subject><subject>METALLURGY</subject><subject>NANOTECHNOLOGY</subject><subject>PERFORMING OPERATIONS</subject><subject>POWDER METALLURGY</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES</subject><subject>TRANSPORTING</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><subject>WORKING METALLIC POWDER</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDydQ3x8HdR8HdT8HX0C3VzdA4JDfL0c1dw9g8IcA1SCPAPdwFSbv5BQBE_l1DnEM8wV4UAx-AQVx4G1rTEnOJUXijNzaDg5hri7KGbWpAfn1pckJicmpdaEu8aYGRmaGJpYOJkaEyEEgBwmSi7</recordid><startdate>20200422</startdate><enddate>20200422</enddate><creator>KANESHIRO, Yuki</creator><creator>SUENAGA, Shinichi</creator><creator>FUJITA, Hidefumi</creator><creator>KISHIDA, Minoru</creator><scope>EVB</scope></search><sort><creationdate>20200422</creationdate><title>METHOD OF MANUFACTURING COPPER POWDER FOR CONDUCTIVE PASTE</title><author>KANESHIRO, Yuki ; SUENAGA, Shinichi ; FUJITA, Hidefumi ; KISHIDA, Minoru</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2614904B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2020</creationdate><topic>ALLOYS</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASTING</topic><topic>CHEMISTRY</topic><topic>CONDUCTORS</topic><topic>ELECTRICITY</topic><topic>FERROUS OR NON-FERROUS ALLOYS</topic><topic>INSULATORS</topic><topic>MAKING METALLIC POWDER</topic><topic>MANUFACTURE OF ARTICLES FROM METALLIC POWDER</topic><topic>MANUFACTURE OR TREATMENT OF NANOSTRUCTURES</topic><topic>MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES</topic><topic>METALLURGY</topic><topic>NANOTECHNOLOGY</topic><topic>PERFORMING OPERATIONS</topic><topic>POWDER METALLURGY</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES</topic><topic>TRANSPORTING</topic><topic>TREATMENT OF ALLOYS OR NON-FERROUS METALS</topic><topic>WORKING METALLIC POWDER</topic><toplevel>online_resources</toplevel><creatorcontrib>KANESHIRO, Yuki</creatorcontrib><creatorcontrib>SUENAGA, Shinichi</creatorcontrib><creatorcontrib>FUJITA, Hidefumi</creatorcontrib><creatorcontrib>KISHIDA, Minoru</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KANESHIRO, Yuki</au><au>SUENAGA, Shinichi</au><au>FUJITA, Hidefumi</au><au>KISHIDA, Minoru</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF MANUFACTURING COPPER POWDER FOR CONDUCTIVE PASTE</title><date>2020-04-22</date><risdate>2020</risdate><abstract>There are provided a copper powder for conductive paste, which comprises monodisperse and spherical fine copper particles having a sharp particle size distribution and containing no coarse particles and which can form a thinner electrode film while avoiding a bad influence on electric characteristics thereof, and a method for stably producing such a copper powder for conductive paste. After copper is complexed by adding a complexing agent to an aqueous solution containing copper while blowing air into the solution, the blowing of air is stopped, and then, a reducing agent is added to the solution to deposit copper particles by reduction.</abstract><oa>free_for_read</oa></addata></record> |
| fulltext | fulltext_linktorsrc |
| identifier | |
| ispartof | |
| issn | |
| language | eng ; fre ; ger |
| recordid | cdi_epo_espacenet_EP2614904B1 |
| source | esp@cenet |
| subjects | ALLOYS BASIC ELECTRIC ELEMENTS CABLES CASTING CHEMISTRY CONDUCTORS ELECTRICITY FERROUS OR NON-FERROUS ALLOYS INSULATORS MAKING METALLIC POWDER MANUFACTURE OF ARTICLES FROM METALLIC POWDER MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES METALLURGY NANOTECHNOLOGY PERFORMING OPERATIONS POWDER METALLURGY SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WORKING METALLIC POWDER |
| title | METHOD OF MANUFACTURING COPPER POWDER FOR CONDUCTIVE PASTE |
| url | https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-20T21%3A42%3A42IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KANESHIRO,%20Yuki&rft.date=2020-04-22&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EEP2614904B1%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true |