EUV EXPOSURE APPARATUS
The invention relates to a projection lens of an EUV-lithographic projection exposure system, comprising: at least two reflective optical elements Mi, each comprising a body MBiand a reflective surface MSifor projecting an object field on a reticle onto an image field on a substrate if the projectio...
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creator | KUERZ, Peter LIMBACH, Guido NATT, Oliver VAN SCHOOT, Jan WITTICH, Gero LOERING, Ulrich LAUFER, Timo HEMBACHER, Stefan HAUF, Markus BAER, Norman WALTER, Holger KWAN, Yim-Bun-Patrick STICKEL, Franz-Josef |
description | The invention relates to a projection lens of an EUV-lithographic projection exposure system, comprising: at least two reflective optical elements Mi, each comprising a body MBiand a reflective surface MSifor projecting an object field on a reticle onto an image field on a substrate if the projection lens is exposed with an exposure power of EUV light with a wavelength in a wavelength range of less than 50 nm, being reflected from the reticle while illuminated by an illumination system of an EUV-lithographic projection exposure system, wherein the bodies MBm, MBnof at least two reflective optical elements comprise a material with a temperature dependent coefficient of thermal expansion which is zero at least two zero cross temperatures T10mnand T20mn, and wherein the lens comprises a support structure for passively or actively supporting the reflective optical elements Mi, wherein the temperature of at least a part of the support structure is at a reference temperature TRef, at least two tempering means for independently heating and/or cooling the at least two bodies MBn, MBm, and a temperature control system for independently controlling the temperature of the at least two heated or cooled bodies MBn, MBmto respective temperatures Tknand a Tkm, and wherein during exposure of the lens with the exposure power of the EUV light the temperatures Tknof the temperature controlled body MBnis within an interval of ± 5K, better ± 2K centered around the first zero cross temperatures T10mn, and the temperatures Tkmof the temperature controlled body MBmis within an interval of ± 5K, better ± 2K centered around the second zero cross temperatures T20mn. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP2598947B1</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP2598947B1</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP2598947B13</originalsourceid><addsrcrecordid>eNrjZBBzDQ1TcI0I8A8ODXJVcAwIcAxyDAkN5mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BRqaWFpYm5k6GxkQoAQCR1R8b</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>EUV EXPOSURE APPARATUS</title><source>esp@cenet</source><creator>KUERZ, Peter ; LIMBACH, Guido ; NATT, Oliver ; VAN SCHOOT, Jan ; WITTICH, Gero ; LOERING, Ulrich ; LAUFER, Timo ; HEMBACHER, Stefan ; HAUF, Markus ; BAER, Norman ; WALTER, Holger ; KWAN, Yim-Bun-Patrick ; STICKEL, Franz-Josef</creator><creatorcontrib>KUERZ, Peter ; LIMBACH, Guido ; NATT, Oliver ; VAN SCHOOT, Jan ; WITTICH, Gero ; LOERING, Ulrich ; LAUFER, Timo ; HEMBACHER, Stefan ; HAUF, Markus ; BAER, Norman ; WALTER, Holger ; KWAN, Yim-Bun-Patrick ; STICKEL, Franz-Josef</creatorcontrib><description>The invention relates to a projection lens of an EUV-lithographic projection exposure system, comprising: at least two reflective optical elements Mi, each comprising a body MBiand a reflective surface MSifor projecting an object field on a reticle onto an image field on a substrate if the projection lens is exposed with an exposure power of EUV light with a wavelength in a wavelength range of less than 50 nm, being reflected from the reticle while illuminated by an illumination system of an EUV-lithographic projection exposure system, wherein the bodies MBm, MBnof at least two reflective optical elements comprise a material with a temperature dependent coefficient of thermal expansion which is zero at least two zero cross temperatures T10mnand T20mn, and wherein the lens comprises a support structure for passively or actively supporting the reflective optical elements Mi, wherein the temperature of at least a part of the support structure is at a reference temperature TRef, at least two tempering means for independently heating and/or cooling the at least two bodies MBn, MBm, and a temperature control system for independently controlling the temperature of the at least two heated or cooled bodies MBn, MBmto respective temperatures Tknand a Tkm, and wherein during exposure of the lens with the exposure power of the EUV light the temperatures Tknof the temperature controlled body MBnis within an interval of ± 5K, better ± 2K centered around the first zero cross temperatures T10mn, and the temperatures Tkmof the temperature controlled body MBmis within an interval of ± 5K, better ± 2K centered around the second zero cross temperatures T20mn.</description><language>eng ; fre ; ger</language><subject>APPARATUS SPECIALLY ADAPTED THEREFOR ; CINEMATOGRAPHY ; ELECTROGRAPHY ; GAMMA RAY OR X-RAY MICROSCOPES ; HOLOGRAPHY ; IRRADIATION DEVICES ; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES ; MATERIALS THEREFOR ; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES ; NANOTECHNOLOGY ; NUCLEAR ENGINEERING ; NUCLEAR PHYSICS ; OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS ; OPTICS ; ORIGINALS THEREFOR ; PERFORMING OPERATIONS ; PHOTOGRAPHY ; PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES ; PHYSICS ; SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES ; TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOTOTHERWISE PROVIDED FOR ; TRANSPORTING</subject><creationdate>2020</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200429&DB=EPODOC&CC=EP&NR=2598947B1$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25563,76318</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200429&DB=EPODOC&CC=EP&NR=2598947B1$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUERZ, Peter</creatorcontrib><creatorcontrib>LIMBACH, Guido</creatorcontrib><creatorcontrib>NATT, Oliver</creatorcontrib><creatorcontrib>VAN SCHOOT, Jan</creatorcontrib><creatorcontrib>WITTICH, Gero</creatorcontrib><creatorcontrib>LOERING, Ulrich</creatorcontrib><creatorcontrib>LAUFER, Timo</creatorcontrib><creatorcontrib>HEMBACHER, Stefan</creatorcontrib><creatorcontrib>HAUF, Markus</creatorcontrib><creatorcontrib>BAER, Norman</creatorcontrib><creatorcontrib>WALTER, Holger</creatorcontrib><creatorcontrib>KWAN, Yim-Bun-Patrick</creatorcontrib><creatorcontrib>STICKEL, Franz-Josef</creatorcontrib><title>EUV EXPOSURE APPARATUS</title><description>The invention relates to a projection lens of an EUV-lithographic projection exposure system, comprising: at least two reflective optical elements Mi, each comprising a body MBiand a reflective surface MSifor projecting an object field on a reticle onto an image field on a substrate if the projection lens is exposed with an exposure power of EUV light with a wavelength in a wavelength range of less than 50 nm, being reflected from the reticle while illuminated by an illumination system of an EUV-lithographic projection exposure system, wherein the bodies MBm, MBnof at least two reflective optical elements comprise a material with a temperature dependent coefficient of thermal expansion which is zero at least two zero cross temperatures T10mnand T20mn, and wherein the lens comprises a support structure for passively or actively supporting the reflective optical elements Mi, wherein the temperature of at least a part of the support structure is at a reference temperature TRef, at least two tempering means for independently heating and/or cooling the at least two bodies MBn, MBm, and a temperature control system for independently controlling the temperature of the at least two heated or cooled bodies MBn, MBmto respective temperatures Tknand a Tkm, and wherein during exposure of the lens with the exposure power of the EUV light the temperatures Tknof the temperature controlled body MBnis within an interval of ± 5K, better ± 2K centered around the first zero cross temperatures T10mn, and the temperatures Tkmof the temperature controlled body MBmis within an interval of ± 5K, better ± 2K centered around the second zero cross temperatures T20mn.</description><subject>APPARATUS SPECIALLY ADAPTED THEREFOR</subject><subject>CINEMATOGRAPHY</subject><subject>ELECTROGRAPHY</subject><subject>GAMMA RAY OR X-RAY MICROSCOPES</subject><subject>HOLOGRAPHY</subject><subject>IRRADIATION DEVICES</subject><subject>MANUFACTURE OR TREATMENT OF NANOSTRUCTURES</subject><subject>MATERIALS THEREFOR</subject><subject>MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES</subject><subject>NANOTECHNOLOGY</subject><subject>NUCLEAR ENGINEERING</subject><subject>NUCLEAR PHYSICS</subject><subject>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</subject><subject>OPTICS</subject><subject>ORIGINALS THEREFOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PHOTOGRAPHY</subject><subject>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</subject><subject>PHYSICS</subject><subject>SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES</subject><subject>TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOTOTHERWISE PROVIDED FOR</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2020</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBBzDQ1TcI0I8A8ODXJVcAwIcAxyDAkN5mFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BRqaWFpYm5k6GxkQoAQCR1R8b</recordid><startdate>20200429</startdate><enddate>20200429</enddate><creator>KUERZ, Peter</creator><creator>LIMBACH, Guido</creator><creator>NATT, Oliver</creator><creator>VAN SCHOOT, Jan</creator><creator>WITTICH, Gero</creator><creator>LOERING, Ulrich</creator><creator>LAUFER, Timo</creator><creator>HEMBACHER, Stefan</creator><creator>HAUF, Markus</creator><creator>BAER, Norman</creator><creator>WALTER, Holger</creator><creator>KWAN, Yim-Bun-Patrick</creator><creator>STICKEL, Franz-Josef</creator><scope>EVB</scope></search><sort><creationdate>20200429</creationdate><title>EUV EXPOSURE APPARATUS</title><author>KUERZ, Peter ; LIMBACH, Guido ; NATT, Oliver ; VAN SCHOOT, Jan ; WITTICH, Gero ; LOERING, Ulrich ; LAUFER, Timo ; HEMBACHER, Stefan ; HAUF, Markus ; BAER, Norman ; WALTER, Holger ; KWAN, Yim-Bun-Patrick ; STICKEL, Franz-Josef</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2598947B13</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2020</creationdate><topic>APPARATUS SPECIALLY ADAPTED THEREFOR</topic><topic>CINEMATOGRAPHY</topic><topic>ELECTROGRAPHY</topic><topic>GAMMA RAY OR X-RAY MICROSCOPES</topic><topic>HOLOGRAPHY</topic><topic>IRRADIATION DEVICES</topic><topic>MANUFACTURE OR TREATMENT OF NANOSTRUCTURES</topic><topic>MATERIALS THEREFOR</topic><topic>MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES</topic><topic>NANOTECHNOLOGY</topic><topic>NUCLEAR ENGINEERING</topic><topic>NUCLEAR PHYSICS</topic><topic>OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS</topic><topic>OPTICS</topic><topic>ORIGINALS THEREFOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PHOTOGRAPHY</topic><topic>PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES</topic><topic>PHYSICS</topic><topic>SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES</topic><topic>TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOTOTHERWISE PROVIDED FOR</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>KUERZ, Peter</creatorcontrib><creatorcontrib>LIMBACH, Guido</creatorcontrib><creatorcontrib>NATT, Oliver</creatorcontrib><creatorcontrib>VAN SCHOOT, Jan</creatorcontrib><creatorcontrib>WITTICH, Gero</creatorcontrib><creatorcontrib>LOERING, Ulrich</creatorcontrib><creatorcontrib>LAUFER, Timo</creatorcontrib><creatorcontrib>HEMBACHER, Stefan</creatorcontrib><creatorcontrib>HAUF, Markus</creatorcontrib><creatorcontrib>BAER, Norman</creatorcontrib><creatorcontrib>WALTER, Holger</creatorcontrib><creatorcontrib>KWAN, Yim-Bun-Patrick</creatorcontrib><creatorcontrib>STICKEL, Franz-Josef</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KUERZ, Peter</au><au>LIMBACH, Guido</au><au>NATT, Oliver</au><au>VAN SCHOOT, Jan</au><au>WITTICH, Gero</au><au>LOERING, Ulrich</au><au>LAUFER, Timo</au><au>HEMBACHER, Stefan</au><au>HAUF, Markus</au><au>BAER, Norman</au><au>WALTER, Holger</au><au>KWAN, Yim-Bun-Patrick</au><au>STICKEL, Franz-Josef</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>EUV EXPOSURE APPARATUS</title><date>2020-04-29</date><risdate>2020</risdate><abstract>The invention relates to a projection lens of an EUV-lithographic projection exposure system, comprising: at least two reflective optical elements Mi, each comprising a body MBiand a reflective surface MSifor projecting an object field on a reticle onto an image field on a substrate if the projection lens is exposed with an exposure power of EUV light with a wavelength in a wavelength range of less than 50 nm, being reflected from the reticle while illuminated by an illumination system of an EUV-lithographic projection exposure system, wherein the bodies MBm, MBnof at least two reflective optical elements comprise a material with a temperature dependent coefficient of thermal expansion which is zero at least two zero cross temperatures T10mnand T20mn, and wherein the lens comprises a support structure for passively or actively supporting the reflective optical elements Mi, wherein the temperature of at least a part of the support structure is at a reference temperature TRef, at least two tempering means for independently heating and/or cooling the at least two bodies MBn, MBm, and a temperature control system for independently controlling the temperature of the at least two heated or cooled bodies MBn, MBmto respective temperatures Tknand a Tkm, and wherein during exposure of the lens with the exposure power of the EUV light the temperatures Tknof the temperature controlled body MBnis within an interval of ± 5K, better ± 2K centered around the first zero cross temperatures T10mn, and the temperatures Tkmof the temperature controlled body MBmis within an interval of ± 5K, better ± 2K centered around the second zero cross temperatures T20mn.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY GAMMA RAY OR X-RAY MICROSCOPES HOLOGRAPHY IRRADIATION DEVICES MANUFACTURE OR TREATMENT OF NANOSTRUCTURES MATERIALS THEREFOR MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES NANOTECHNOLOGY NUCLEAR ENGINEERING NUCLEAR PHYSICS OPTICAL ELEMENTS, SYSTEMS, OR APPARATUS OPTICS ORIGINALS THEREFOR PERFORMING OPERATIONS PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES TECHNIQUES FOR HANDLING PARTICLES OR IONISING RADIATION NOTOTHERWISE PROVIDED FOR TRANSPORTING |
title | EUV EXPOSURE APPARATUS |
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