Mitigation of block bending in a ring laser gyroscope caused by thermal expansion or compression of a circuit board
An apparatus includes a sheet of circuit board material, at least one electrically conductive trace positioned on the sheet of circuit board material, and at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically c...
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Format: | Patent |
Sprache: | eng ; fre ; ger |
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