Mitigation of block bending in a ring laser gyroscope caused by thermal expansion or compression of a circuit board

Mitigation of block bending in a ring laser gyroscope caused by thermal expansion or compression of a circuit board

An apparatus includes a sheet of circuit board material, at least one electrically conductive trace positioned on the sheet of circuit board material, and at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically c...

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Hauptverfasser: KOSHIOL, MYLES, CLARK, MATTHEW, GALBRECHT, CRAIG A, GOBLISH, GEORGE L
Format: Patent
Sprache:eng ; fre ; ger
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator KOSHIOL, MYLES
CLARK, MATTHEW
GALBRECHT, CRAIG A
GOBLISH, GEORGE L
description An apparatus includes a sheet of circuit board material, at least one electrically conductive trace positioned on the sheet of circuit board material, and at least one electrically conductive contact pad positioned on the sheet of circuit board material and coupled to the at least one electrically conductive trace. The apparatus further includes at least one deformation point configured to absorb stresses developed in the sheet of circuit board material when the sheet of circuit board material experiences resistance to expansion or compression caused by connection to an object resisting expansion or compression.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title Mitigation of block bending in a ring laser gyroscope caused by thermal expansion or compression of a circuit board
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