METHOD FOR PRODUCING CIRCUIT BOARD
A method of manufacturing a reuse paste includes the steps of preparing a fiber piece housing paste, fabricating a filtered recovery paste and fabricating a reuse paste. At the step of preparing a fiber piece housing paste, there is prepared a fiber piece housing paste including a conductive paste h...
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creator | HIMORI, TSUYOSHI KATSUMATA, MASAAKI KONDOU, TOSHIKAZU |
description | A method of manufacturing a reuse paste includes the steps of preparing a fiber piece housing paste, fabricating a filtered recovery paste and fabricating a reuse paste. At the step of preparing a fiber piece housing paste, there is prepared a fiber piece housing paste including a conductive paste having conductive powder and a resin, and a fiber piece taken away from a prepreg to be used for manufacturing a circuit board. At the step of fabricating a filtered recovery paste, the fiber piece housing paste in a paste state is filtered as it is by using a filter and a filtered recovery paste is thus fabricated. At the step of fabricating a reuse paste, at least one of a solvent, a resin and a paste having a different composition from the filtered recovery paste is added to the filtered recovery paste, and the reuse paste is thus fabricated. |
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fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_EP2571340A4</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>EP2571340A4</sourcerecordid><originalsourceid>FETCH-epo_espacenet_EP2571340A43</originalsourceid><addsrcrecordid>eNrjZFDydQ3x8HdRcPMPUggI8ncJdfb0c1dw9gxyDvUMUXDydwxy4WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BRqbmhsYmBo4mxkQoAQDtsCHx</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>METHOD FOR PRODUCING CIRCUIT BOARD</title><source>esp@cenet</source><creator>HIMORI, TSUYOSHI ; KATSUMATA, MASAAKI ; KONDOU, TOSHIKAZU</creator><creatorcontrib>HIMORI, TSUYOSHI ; KATSUMATA, MASAAKI ; KONDOU, TOSHIKAZU</creatorcontrib><description>A method of manufacturing a reuse paste includes the steps of preparing a fiber piece housing paste, fabricating a filtered recovery paste and fabricating a reuse paste. At the step of preparing a fiber piece housing paste, there is prepared a fiber piece housing paste including a conductive paste having conductive powder and a resin, and a fiber piece taken away from a prepreg to be used for manufacturing a circuit board. At the step of fabricating a filtered recovery paste, the fiber piece housing paste in a paste state is filtered as it is by using a filter and a filtered recovery paste is thus fabricated. At the step of fabricating a reuse paste, at least one of a solvent, a resin and a paste having a different composition from the filtered recovery paste is added to the filtered recovery paste, and the reuse paste is thus fabricated.</description><language>eng ; fre ; ger</language><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL ; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL ; BASIC ELECTRIC ELEMENTS ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CONDUCTORS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INSULATORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; SPRAYING OR ATOMISING IN GENERAL ; TRANSPORTING</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140108&DB=EPODOC&CC=EP&NR=2571340A4$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140108&DB=EPODOC&CC=EP&NR=2571340A4$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HIMORI, TSUYOSHI</creatorcontrib><creatorcontrib>KATSUMATA, MASAAKI</creatorcontrib><creatorcontrib>KONDOU, TOSHIKAZU</creatorcontrib><title>METHOD FOR PRODUCING CIRCUIT BOARD</title><description>A method of manufacturing a reuse paste includes the steps of preparing a fiber piece housing paste, fabricating a filtered recovery paste and fabricating a reuse paste. At the step of preparing a fiber piece housing paste, there is prepared a fiber piece housing paste including a conductive paste having conductive powder and a resin, and a fiber piece taken away from a prepreg to be used for manufacturing a circuit board. At the step of fabricating a filtered recovery paste, the fiber piece housing paste in a paste state is filtered as it is by using a filter and a filtered recovery paste is thus fabricated. At the step of fabricating a reuse paste, at least one of a solvent, a resin and a paste having a different composition from the filtered recovery paste is added to the filtered recovery paste, and the reuse paste is thus fabricated.</description><subject>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</subject><subject>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CONDUCTORS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>INSULATORS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>SPRAYING OR ATOMISING IN GENERAL</subject><subject>TRANSPORTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFDydQ3x8HdRcPMPUggI8ncJdfb0c1dw9gxyDvUMUXDydwxy4WFgTUvMKU7lhdLcDApuriHOHrqpBfnxqcUFicmpeakl8a4BRqbmhsYmBo4mxkQoAQDtsCHx</recordid><startdate>20140108</startdate><enddate>20140108</enddate><creator>HIMORI, TSUYOSHI</creator><creator>KATSUMATA, MASAAKI</creator><creator>KONDOU, TOSHIKAZU</creator><scope>EVB</scope></search><sort><creationdate>20140108</creationdate><title>METHOD FOR PRODUCING CIRCUIT BOARD</title><author>HIMORI, TSUYOSHI ; KATSUMATA, MASAAKI ; KONDOU, TOSHIKAZU</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_EP2571340A43</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; fre ; ger</language><creationdate>2014</creationdate><topic>APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL</topic><topic>APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CONDUCTORS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>INSULATORS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>SPRAYING OR ATOMISING IN GENERAL</topic><topic>TRANSPORTING</topic><toplevel>online_resources</toplevel><creatorcontrib>HIMORI, TSUYOSHI</creatorcontrib><creatorcontrib>KATSUMATA, MASAAKI</creatorcontrib><creatorcontrib>KONDOU, TOSHIKAZU</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HIMORI, TSUYOSHI</au><au>KATSUMATA, MASAAKI</au><au>KONDOU, TOSHIKAZU</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD FOR PRODUCING CIRCUIT BOARD</title><date>2014-01-08</date><risdate>2014</risdate><abstract>A method of manufacturing a reuse paste includes the steps of preparing a fiber piece housing paste, fabricating a filtered recovery paste and fabricating a reuse paste. At the step of preparing a fiber piece housing paste, there is prepared a fiber piece housing paste including a conductive paste having conductive powder and a resin, and a fiber piece taken away from a prepreg to be used for manufacturing a circuit board. At the step of fabricating a filtered recovery paste, the fiber piece housing paste in a paste state is filtered as it is by using a filter and a filtered recovery paste is thus fabricated. At the step of fabricating a reuse paste, at least one of a solvent, a resin and a paste having a different composition from the filtered recovery paste is added to the filtered recovery paste, and the reuse paste is thus fabricated.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | APPARATUS FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CONDUCTORS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SPRAYING OR ATOMISING IN GENERAL TRANSPORTING |
title | METHOD FOR PRODUCING CIRCUIT BOARD |
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