Light emitting diode package

Embodiments provide a light emitting diode package (200) including a package body (210) having a through-hole; a radiator (220) disposed in the through-hole and including an alloy layer (221) having Cu; and a light emitting diode (230) disposed on the radiator, wherein the alloy layer includes at le...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	JUNG, SU JUNG, HWANG, SON KYO, KWON, SEO YEON, CHO, YOUNG JUN, MOON, YON TAE, KIM, BYUNG MOK
Format:	Patent
Sprache:	eng ; fre ; ger
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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